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公开(公告)号：US09527340B2
公开(公告)日：2016-12-27
申请号：US14833688
申请日：2015-08-24
Applicant: Illinois Tool Works Inc.
Inventor： Daniel M. Szumski , William A. Herring , Suwit Sangkaratana
IPC: B44F1/10 , B32B38/14 , B44C1/175 , B44C1/20 , B44F9/00 , B44C3/02 , B32B38/06 , B44F1/02 , B44F1/14 , B05D5/06 , B05D7/00 , B44C1/00 , B42D25/425 , B42D25/45 , B42D25/328 , B33Y10/00
CPC classification number: B44F1/10 , B05D5/061 , B05D7/50 , B32B38/06 , B32B38/14 , B33Y10/00 , B42D25/328 , B42D25/425 , B42D25/45 , B44C1/005 , B44C1/175 , B44C1/1758 , B44C1/20 , B44C3/02 , B44F1/02 , B44F1/14 , B44F9/00
Abstract: A method for the manufacture of a composite laminate assembly that includes decorative, functional, security, reflective, diffractive, holographic elements for liquid transfer onto the surface of a variety of base materials or work piece having a flat or complex three dimensional shape.
Abstract translation: 一种用于制造复合层压组件的方法，该复合层压组件包括装饰性，功能性，安全性，反射性，衍射全息元件，用于将液体转移到各种基材或具有平坦或复杂三维形状的工件的表面上。
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2.发明申请公开(公告)号：US20190283483A1
公开(公告)日：2019-09-19
申请号：US16421180
申请日：2019-05-23
Applicant: Illinois Tool Works Inc.
Inventor： Daniel Mark Szumski , Matthew Robert Shields , William A. Herring
IPC: B42D25/373 , G06K19/16 , G06K19/077 , B42D25/369 , B32B37/24 , B32B38/00 , B42D25/47
Abstract: A laminated core stock sheet for use in a composite laminate assembly configured for being separated into plural individual cards is provided. The laminated core stock sheet includes a core substrate layer and an intermediate filmic layer coupled to the core substrate layer. The intermediate filmic layer includes plural conductive bodies spaced apart from each other that provide at least one of a security feature, a decorative feature, or other functional feature of the individual cards. The core substrate layer and the intermediate filmic layer are configured to be coupled with another laminated core stock sheet that may or may not include the intermediate filmic layer to form the composite laminate assembly configured for being separated into the individual cards.
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公开(公告)号：US20150114062A1
公开(公告)日：2015-04-30
申请号：US14584945
申请日：2014-12-29
Applicant: Illinois Tool Works Inc.
Inventor： Louis M. Spoto , Dean J. Randazzo , Matthew J. Deschner , William A. Herring , Shannon K. Crawford-Taylor , Suwit Sangkaratana , Paul R. Jelonek , Alan J. Varacins
CPC classification number: B21B27/005 , B21B27/02 , B29C59/026 , B29C59/04 , B31F1/07 , B31F2201/0723 , B41N6/00 , B44B5/0047 , B44B5/0052 , B44B5/026 , Y10T29/49563 , Y10T428/12292 , Y10T428/12389 , Y10T428/13 , Y10T428/131 , Y10T428/139 , Y10T428/1393 , Y10T428/24479 , Y10T428/24521
Abstract: A seamless, embossed or cast substrate is formed using a seamless sleeve having a seamless surface relief formed thereon and configured to slide over an cylindrical base in an embossing or casting assembly. The substrate is a flat web, foil, or film of, for example, paper, polyester, polypropylene, metal or other elongated flat material. The surface relief can be applied through interfering ablation, non-interfering ablation, ink jet printing, or other techniques wherein a seamless surface relief is formed onto the seamless sleeve. A method of making a seamless, embossed or cast substrate includes expanding a diameter of a seamless sleeve having a seamless surface relief formed thereon, sliding the expanded seamless sleeve onto a cylindrical base, allowing the diameter of the seamless sleeve to contract around the cylindrical base, and conveying a substrate through the embossing or casting assembly and embossing or casting the seamless surface relief into the substrate.
Abstract translation: 使用在其上形成有无缝表面浮雕的无缝套筒形成无缝的，压花的或铸造的基底，并且构造成在压花或铸造组件中在圆柱形基座上滑动。 基材是例如纸，聚酯，聚丙烯，金属或其它细长扁平材料的扁平网状物，箔或膜。 表面浮雕可以通过干涉消融，非干涉消融，喷墨印刷或其它技术施加，其中在无缝套管上形成无缝的表面浮雕。 制造无缝，压花或铸造基片的方法包括使形成有无缝表面凹凸的无缝套管的直径扩大，将扩展的无缝套筒滑动到圆柱形基座上，允许无缝套筒的直径在圆柱形基座 并且通过压花或铸造组件输送基底并将无缝表面浮雕压花或铸造到基底中。
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4.发明授权公开(公告)号：US10178778B2
公开(公告)日：2019-01-08
申请号：US13839444
申请日：2013-03-15
Applicant: ILLINOIS TOOL WORKS, INC
Inventor： John H. Schneider , William A. Herring
Abstract: A transferable film includes a carrier layer and an intermediate film portion. The carrier layer is configured to receive one or more additional layers and to be releasable from the one or more additional layers temporally proximate to an application of the transferable film to an object. The intermediate film portion includes a readable conductive image portion and is configured for application thereto of an adhesive layer. The intermediate film portion is configured to be interposed between the carrier layer and the adhesive layer, and the adhesive layer configured to adhere to the object for the application of the transferable film to the object.
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公开(公告)号：US20140225837A1
公开(公告)日：2014-08-14
申请号：US13765418
申请日：2013-02-12
Applicant: ILLINOIS TOOL WORKS, INC.
Inventor： John H. Schneider , William A. Herring , Daniel W. Johnston
IPC: G06F3/041
CPC classification number: G06F3/041 , H01H13/704 , H01H13/81 , H01H13/88 , H01H2207/004 , H01H2229/002 , H01H2229/03 , H01H2239/01
Abstract: A front panel overlay having a plurality of layers and one or more logic circuits incorporated therein is disclosed. One of the plurality of layers may have a first electrical contact and another one of the plurality of layers may have a second electrical contact. The one or more logic circuits may be incorporated at least indirectly within the plurality of layers and may be activated when the first electrical contact completes an electrical circuit with the second electrical contact.
Abstract translation: 公开了具有多个层的前面板覆盖层和并入其中的一个或多个逻辑电路。 多个层中的一个可以具有第一电接触，并且多个层中的另一个可以具有第二电接触。 一个或多个逻辑电路可以至少间接地并入多个层内，并且当第一电触点与第二电触点完成电路时可以被激活。
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Patent Agency Ranking
公开(公告)号：US10336125B2
公开(公告)日：2019-07-02
申请号：US14473656
申请日：2014-08-29
Applicant: Illinois Tool Works Inc.
Inventor： Daniel Mark Szumski , Matthew Robert Shields , William A. Herring
IPC: B32B37/24 , B32B38/00 , B42D25/47 , G06K19/16 , B42D25/369 , B42D25/373 , G06K19/077
Abstract: A laminated core stock sheet for use in a composite laminate assembly configured for being separated into plural individual cards is provided. The laminated core stock sheet includes a core substrate layer and an intermediate filmic layer coupled to the core substrate layer. The intermediate filmic layer includes plural conductive bodies spaced apart from each other that provide at least one of a security feature, a decorative feature, or other functional feature of the individual cards. The core substrate layer and the intermediate filmic layer are configured to be coupled with another laminated core stock sheet that may or may not include the intermediate filmic layer to form the composite laminate assembly configured for being separated into the individual cards.
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7.发明授权Film transferable logic circuit, and methods for providing film transferable logic circuit 有权电影可转换逻辑电路，以及提供胶片转印逻辑电路的方法公开(公告)号：US09006082B2
公开(公告)日：2015-04-14
申请号：US13839010
申请日：2013-03-15
Applicant: Illinois Tool Works, Inc
Inventor： John H. Schneider , William A. Herring
IPC: H01L21/30 , H01L29/06 , H01L25/065 , H01L23/00
CPC classification number: H01L25/065 , H01L21/6836 , H01L23/544 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/82 , H01L24/83 , H01L24/86 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68381 , H01L2223/5444 , H01L2224/24175 , H01L2224/32175 , H01L2224/82101 , H01L2224/83851 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
Abstract: A filmic circuit includes a circuit portion and a carrier layer. The circuit portion includes a logic circuit that includes, for example, plural logic gates configurable to receive an input and provide a corresponding logical output. The carrier layer is configured as a film. The circuit portion is affixed directly to the carrier layer or to an upper coat disposed adjacent to the carrier layer, and the carrier layer is configured to be releasable from the circuit portion after the filmic circuit assembly is affixed to a target. The circuit portion is configured to receive an adhesive layer configured to affix the filmic circuit assembly to the target.
Abstract translation: 电影电路包括电路部分和载体层。 电路部分包括逻辑电路，该逻辑电路包括例如可配置为接收输入并提供对应的逻辑输出的多个逻辑门。 载体层被配置为膜。 电路部分被直接固定到载体层或与载体层相邻布置的上涂层，并且载体层被配置为在膜电路组件固定到靶之后可从电路部分释放。 电路部分被配置为接收被配置为将胶片电路组件固定到目标的粘合剂层。
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8.发明申请TRANSFERABLE FILM INCLUDING READABLE CONDUCTIVE IMAGE, AND METHODS FOR PROVIDING TRANSFERABLE FILM 审中-公开包括可读导电图像的可转印薄膜，以及提供可转印薄膜的方法公开(公告)号：US20140261961A1
公开(公告)日：2014-09-18
申请号：US13839444
申请日：2013-03-15
Applicant: ILLINOIS TOOL WORKS INC.
Inventor： John H. Schneider , William A. Herring
CPC classification number: H05K3/305 , B32B33/00 , B32B2037/268 , B32B2367/00 , H05K1/0269 , H05K2201/09927 , H05K2201/09936 , Y02P70/613 , Y10T156/10 , Y10T428/24843 , Y10T428/24851 , Y10T428/2486
Abstract: A transferable film includes a carrier layer and an intermediate film portion. The carrier layer is configured to receive one or more additional layers and to be releasable from the one or more additional layers temporally proximate to an application of the transferable film to an object. The intermediate film portion includes a readable conductive image portion and is configured for application thereto of an adhesive layer. The intermediate film portion is configured to be interposed between the carrier layer and the adhesive layer, and the adhesive layer configured to adhere to the object for the application of the transferable film to the object.
Abstract translation: 可转印膜包括载体层和中间膜部分。 载体层被配置为接收一个或多个附加层并且可从时间上接近可转移膜施加到物体的一个或多个附加层释放。 中间膜部分包括可读导电图像部分，并且被配置为向其施加粘合剂层。 中间膜部被配置为插入在载体层和粘合剂层之间，并且粘合剂层被构造成粘附到物体上以将可转移膜施加到物体。
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公开(公告)号：US10265745B2
公开(公告)日：2019-04-23
申请号：US14584945
申请日：2014-12-29
Applicant: Illinois Tool Works Inc.
Inventor： Louis M. Spoto , Dean J. Randazzo , Matthew J. Deschner , William A. Herring , Shannon K. Crawford-Taylor , Suwit Sangkaratana , Paul R. Jelonek , Alan J. Varacins
IPC: B21B27/03 , B21B27/00 , B31F1/07 , B41N6/00 , B44B5/00 , B44B5/02 , B21B27/02 , B29C59/02 , B29C59/04
Abstract: A seamless, embossed or cast substrate is formed using a seamless sleeve having a seamless surface relief formed thereon and configured to slide over an cylindrical base in an embossing or casting assembly. The substrate is a flat web, foil, or film of, for example, paper, polyester, polypropylene, metal or other elongated flat material. The surface relief can be applied through interfering ablation, non-interfering ablation, ink jet printing, or other techniques wherein a seamless surface relief is formed onto the seamless sleeve. A method of making a seamless, embossed or cast substrate includes expanding a diameter of a seamless sleeve having a seamless surface relief formed thereon, sliding the expanded seamless sleeve onto a cylindrical base, allowing the diameter of the seamless sleeve to contract around the cylindrical base, and conveying a substrate through the embossing or casting assembly and embossing or casting the seamless surface relief into the substrate.
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公开(公告)号：US09996173B2
公开(公告)日：2018-06-12
申请号：US13765418
申请日：2013-02-12
Applicant: Illinois Tool Works, Inc.
Inventor： John H. Schneider , William A. Herring , Daniel W. Johnston
IPC: G06F3/041 , H01H13/704 , H01H13/81 , H01H13/88
CPC classification number: G06F3/041 , H01H13/704 , H01H13/81 , H01H13/88 , H01H2207/004 , H01H2229/002 , H01H2229/03 , H01H2239/01
Abstract: A front panel overlay having a plurality of layers and one or more logic circuits incorporated therein is disclosed. One of the plurality of layers may have a first electrical contact and another one of the plurality of layers may have a second electrical contact. The one or more logic circuits may be incorporated at least indirectly within the plurality of layers and may be activated when the first electrical contact completes an electrical circuit with the second electrical contact.
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