公开(公告)号：US20150181693A1

公开(公告)日：2015-06-25

申请号：US14226526

申请日：2014-03-26

Applicant: Industrial Technology Research Institute

Inventor： Shih-Hsien WU ,  Min-Lin LEE

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/11

CPC classification number: H05K1/0227 ,  H05K1/0222 ,  H05K1/0251 ,  H05K1/115 ,  H05K1/116 ,  H05K3/4685 ,  H05K2201/09854 ,  Y10T29/49165

Abstract: The disclosure provides a manufacturing method for a circuit board having a via and including a substrate, a ground conductor, a floated conductor and a signal conductor. The substrate includes a second sheet layer, a second ground layer, a core layer, a first ground layer and a first sheet layer that are stacked in sequence from bottom to top. The ground conductor penetrates through the core layer and is electrically coupled to the first ground layer and the second ground layer. The floated conductor penetrates through the core layer and is electrically insulated from the first ground layer, the second ground layer and the ground conductor. The signal conductor penetrates through the substrate, being located between the ground conductor and the floated conductor, and insulated from the first ground layer, the second ground layer, the ground conductor and the floated conductor.

Abstract translation: 本发明提供了一种具有通孔并且包括衬底，接地导体，浮动导体和信号导体的电路板的制造方法。 基板包括从底部到顶部依次层叠的第二片层，第二接地层，芯层，第一接地层和第一片层。 接地导体穿过芯层并电耦合到第一接地层和第二接地层。 浮动导体穿过芯层，并与第一接地层，第二接地层和接地导体电绝缘。 信号导体穿过衬底，位于接地导体和浮动导体之间，并与第一接地层，第二接地层，接地导体和浮动导体绝缘。

公开(公告)号：US20160174360A1

公开(公告)日：2016-06-16

申请号：US14950584

申请日：2015-11-24

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chien-Min HSU ,  Shih-Hsien WU ,  Jing-Yao CHANG ,  Tao-Chih CHANG ,  Ren-Shin CHENG ,  Min-Lin LEE

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/10 ,  H05K3/42 ,  H05K3/06 ,  H05K3/18 ,  H05K1/11 ,  H01P11/00

CPC classification number: H05K1/116 ,  H05K1/0251 ,  H05K3/42 ,  H05K2201/0187 ,  H05K2201/09545 ,  H05K2203/1105 ,  H05K2203/1178 ,  H05K2203/143 ,  H05K2203/1438

Abstract: A signal transmission board includes a substrate, a conductive via, a cavity and a connecting hole. The substrate has a first external surface and a second external surface. The conductive via penetrating through the substrate has a first end and a second end. The first end is disposed on the first external surface, and the second end is disposed on the second external surface. The cavity is disposed in the substrate and penetrated by the conductive via. The connecting hole disposed on the substrate has a third end and a fourth end. The third end is disposed on the first external surface, and the fourth end communicates with the cavity.

Abstract translation: 信号传输板包括基板，导电孔，空腔和连接孔。 基板具有第一外表面和第二外表面。 穿透基板的导电通孔具有第一端和第二端。 第一端设置在第一外表面上，第二端设置在第二外表面上。 空腔设置在基板中并被导电通孔穿透。 设置在基板上的连接孔具有第三端和第四端。 第三端设置在第一外表面上，第四端与空腔连通。