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1.发明授权公开(公告)号：US09204557B2
公开(公告)日：2015-12-01
申请号：US14073875
申请日：2013-11-07
Applicant: Industrial Technology Research Institute
Inventor： Hsiao-Yen Lee , Yu-Yang Chang , Pao-Ming Tsai
CPC classification number: H05K3/284 , G06F1/1652 , H01L51/5246 , H01L2251/5338 , Y10T29/49888
Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, gas barrier structures, micro-structures, and a filler layer is provided. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate. The gas barrier structures may be located between the first substrate and the second substrate and surround the environmental sensitive electronic device. The gas barrier structures have a first height. The micro-structures may be located between the first substrate and the second substrate and have a second height. A ratio of the second height to the first height ranges from 1/250 to 1/100. The filler layer may be located between the first substrate and the second substrate and covers the gas barrier structures and the environmental sensitive electronic device. A manufacturing method of an environmental sensitive electronic device package is also provided.
Abstract translation: 提供了包括第一基板，第二基板，环境敏感电子设备，气体阻隔结构，微结构和填充层的环境敏感的电子设备封装。 第二基板位于第一基板的上方。 环境敏感电子设备位于第一基板上。 气体阻挡结构可以位于第一基板和第二基板之间并且环绕环境敏感的电子设备。 阻气结构具有第一高度。 微结构可以位于第一基板和第二基板之间并且具有第二高度。 第二高度与第一高度之比为1/250至1/100。 填充层可以位于第一基板和第二基板之间，并且覆盖气体阻挡结构和环境敏感的电子设备。 还提供了一种环境敏感电子设备封装的制造方法。
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公开(公告)号：US08945821B2
公开(公告)日：2015-02-03
申请号：US14487047
申请日：2014-09-15
Applicant: Industrial Technology Research Institute
Inventor： Pao-Ming Tsai , Yu-Yang Chang , Liang-You Jiang , Yu-Jen Chen
CPC classification number: G03F7/343 , G02F1/00 , G02F1/133305 , G03F7/2016 , G03F7/34
Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.
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公开(公告)号：US08932804B1
公开(公告)日：2015-01-13
申请号：US14487037
申请日：2014-09-15
Applicant: Industrial Technology Research Institute
Inventor： Pao-Ming Tsai , Yu-Yang Chang , Liang-You Jiang , Yu-Jen Chen
CPC classification number: G03F7/343 , G02F1/00 , G02F1/133305 , G03F7/2016 , G03F7/34
Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.
Abstract translation: 本发明提供了一种用于图案化柔性基板的方法。 图案化柔性基板的方法包括提供载体基板。 在载体基板上形成剥离层。 在剥离层上形成柔性基材膜。 形成多个UV阻挡掩模图案，覆盖柔性基底膜和释放层的各个部分。 执行紫外线照射工艺以将柔性基底膜和未被UV阻挡掩模图案覆盖的剥离层暴露于UV光。 进行剥离步骤，使得柔性基材薄膜的不暴露于紫外光的各个部分的正上方的各个部分与载体基板分离。
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公开(公告)号：US20150004548A1
公开(公告)日：2015-01-01
申请号：US14487037
申请日：2014-09-15
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Pao-Ming Tsai , Yu-Yang Chang , Liang-You Jiang , Yu-Jen Chen
CPC classification number: G03F7/343 , G02F1/00 , G02F1/133305 , G03F7/2016 , G03F7/34
Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.
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公开(公告)号：US20140374736A1
公开(公告)日：2014-12-25
申请号：US14481924
申请日：2014-09-10
Applicant: Industrial Technology Research Institute
Inventor： Hsiao-Fen Wei , Liang-You Jiang , Pao-Ming Tsai , Yu-Yang Chang
CPC classification number: H01L51/524 , B32B3/04 , B32B7/02 , B32B9/005 , B32B15/085 , B32B15/09 , B32B17/00 , B32B27/281 , B32B37/025 , B32B38/0004 , B32B38/10 , B32B2037/243 , B32B2307/7242 , B32B2307/7246 , B32B2439/00 , B32B2457/00 , B32B2457/20 , B32B2457/206 , B32B2457/208 , H01L51/5253 , H01L51/5256 , H01L2251/5338 , Y10T428/24488 , Y10T428/24521
Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
Abstract translation: 提供了包括第一阻气层，衬底和第二阻气层的阻气性衬底。 第一阻气层具有与基板结合的中心粘合表面和围绕中心粘结表面的周边编织表面。 第二阻气层完全覆盖基板和第一阻气层。 所述第二阻气层与所述基板和所述第一阻气层的周边配附面接合，其中，从所述基板的边缘到所述第一阻气层的边缘的最小距离大于所述第一气体阻隔层的厚度 阻挡层。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20140160705A1
公开(公告)日：2014-06-12
申请号：US14073875
申请日：2013-11-07
Applicant: Industrial Technology Research Institute
Inventor： Hsiao-Yen Lee , Yu-Yang Chang , Pao-Ming Tsai
CPC classification number: H05K3/284 , G06F1/1652 , H01L51/5246 , H01L2251/5338 , Y10T29/49888
Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, gas barrier structures, micro-structures, and a filler layer is provided. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate. The gas barrier structures may be located between the first substrate and the second substrate and surround the environmental sensitive electronic device. The gas barrier structures have a first height. The micro-structures may be located between the first substrate and the second substrate and have a second height. A ratio of the second height to the first height ranges from 1/250 to 1/100. The filler layer may be located between the first substrate and the second substrate and covers the gas barrier structures and the environmental sensitive electronic device. A manufacturing method of an environmental sensitive electronic device package is also provided.
Abstract translation: 提供了包括第一基板，第二基板，环境敏感电子设备，气体阻隔结构，微结构和填充层的环境敏感的电子设备封装。 第二基板位于第一基板的上方。 环境敏感电子设备位于第一基板上。 气体阻挡结构可以位于第一基板和第二基板之间并且环绕环境敏感的电子设备。 阻气结构具有第一高度。 微结构可以位于第一基板和第二基板之间并且具有第二高度。 第二高度与第一高度之比为1/250至1/100。 填充层可以位于第一基板和第二基板之间，并且覆盖气体阻挡结构和环境敏感的电子设备。 还提供了一种环境敏感电子设备封装的制造方法。
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公开(公告)号：US09142797B2
公开(公告)日：2015-09-22
申请号：US14481924
申请日：2014-09-10
Applicant: Industrial Technology Research Institute
Inventor： Hsiao-Fen Wei , Liang-You Jiang , Pao-Ming Tsai , Yu-Yang Chang
IPC: H01L51/52 , H05B33/04 , B32B7/02 , B32B17/00 , B32B9/00 , B32B15/085 , B32B15/09 , B32B37/00 , B32B38/10 , B32B38/00 , B32B37/24
CPC classification number: H01L51/524 , B32B3/04 , B32B7/02 , B32B9/005 , B32B15/085 , B32B15/09 , B32B17/00 , B32B27/281 , B32B37/025 , B32B38/0004 , B32B38/10 , B32B2037/243 , B32B2307/7242 , B32B2307/7246 , B32B2439/00 , B32B2457/00 , B32B2457/20 , B32B2457/206 , B32B2457/208 , H01L51/5253 , H01L51/5256 , H01L2251/5338 , Y10T428/24488 , Y10T428/24521
Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
Abstract translation: 提供了包括第一阻气层，衬底和第二阻气层的阻气性衬底。 第一阻气层具有与基板结合的中心粘合表面和围绕中心粘结表面的周边编织表面。 第二阻气层完全覆盖基板和第一阻气层。 所述第二阻气层与所述基板和所述第一阻气层的周边配附面接合，其中，从所述基板的边缘到所述第一阻气层的边缘的最小距离大于所述第一气体阻隔层的厚度 阻挡层。
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公开(公告)号：US20150004549A1
公开(公告)日：2015-01-01
申请号：US14487047
申请日：2014-09-15
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Pao-Ming Tsai , Yu-Yang Chang , Liang-You Jiang , Yu-Jen Chen
CPC classification number: G03F7/343 , G02F1/00 , G02F1/133305 , G03F7/2016 , G03F7/34
Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.
Abstract translation: 本发明提供了一种用于图案化柔性基板的方法。 图案化柔性基板的方法包括提供载体基板。 在载体基板上形成剥离层。 在剥离层上形成柔性基材膜。 形成多个UV阻挡掩模图案，覆盖柔性基底膜和释放层的各个部分。 执行紫外线照射工艺以将柔性基底膜和未被UV阻挡掩模图案覆盖的剥离层暴露于UV光。 进行剥离步骤，使得柔性基材薄膜的不暴露于紫外光的各个部分的正上方的各个部分与载体基板分离。
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9.发明申请FABRICATING MEHTOD OF GAS BARRIER SUBSTRATE, ORGANIC ELECTRO-LUMINESCENT DEVICE AND PACKAGING METHOD THEREOF 有权有机电致发光器件制造气体基板的制造方法及其包装方法公开(公告)号：US20130295814A1
公开(公告)日：2013-11-07
申请号：US13895379
申请日：2013-05-16
Applicant: Industrial Technology Research Institute
Inventor： Hsiao-Fen Wei , Liang-You Jiang , Pao-Ming Tsai , Yu-Yang Chang
CPC classification number: H05B33/04 , B32B15/085 , B32B15/09 , B32B37/025 , B32B38/0004 , B32B38/10 , B32B2037/243 , B32B2457/20 , B32B2457/206 , B32B2457/208 , H01L51/524 , H01L51/5253 , H01L51/5256 , H05B33/10 , Y10T156/10 , Y10T428/239
Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
Abstract translation: 提供了包括第一阻气层，衬底和第二阻气层的阻气性衬底。 第一阻气层具有与基板结合的中心粘合表面和围绕中心粘结表面的周边编织表面。 第二阻气层完全覆盖基板和第一阻气层。 所述第二阻气层与所述基板和所述第一阻气层的周边配附面接合，其中，从所述基板的边缘到所述第一阻气层的边缘的最小距离大于所述第一气体阻隔层的厚度 阻挡层。
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10.发明授权Fabricating method of gas barrier substrate, organic electro-luminescent device and packaging method thereof 有权阻气性衬底的制造方法，有机电致发光器件及其封装方法公开(公告)号：US08864540B2
公开(公告)日：2014-10-21
申请号：US13895379
申请日：2013-05-16
Applicant: Industrial Technology Research Institute
Inventor： Hsiao-Fen Wei , Liang-You Jiang , Pao-Ming Tsai , Yu-Yang Chang
IPC: H05B33/04 , H05B33/10 , B32B38/10 , H01L51/52 , B32B15/09 , B32B15/085 , B32B37/00 , B32B37/24 , B32B38/00
CPC classification number: H05B33/04 , B32B15/085 , B32B15/09 , B32B37/025 , B32B38/0004 , B32B38/10 , B32B2037/243 , B32B2457/20 , B32B2457/206 , B32B2457/208 , H01L51/524 , H01L51/5253 , H01L51/5256 , H05B33/10 , Y10T156/10 , Y10T428/239
Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
Abstract translation: 提供了包括第一阻气层，衬底和第二阻气层的阻气性衬底。 第一阻气层具有与基板结合的中心粘合表面和围绕中心粘结表面的周边编织表面。 第二阻气层完全覆盖基板和第一阻气层。 所述第二阻气层与所述基板和所述第一阻气层的周边配附面接合，其中，从所述基板的边缘到所述第一阻气层的边缘的最小距离大于所述第一气体阻隔层的厚度 阻挡层。
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