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公开(公告)号：US08945821B2
公开(公告)日：2015-02-03
申请号：US14487047
申请日：2014-09-15
Applicant: Industrial Technology Research Institute
Inventor： Pao-Ming Tsai , Yu-Yang Chang , Liang-You Jiang , Yu-Jen Chen
CPC classification number: G03F7/343 , G02F1/00 , G02F1/133305 , G03F7/2016 , G03F7/34
Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.
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公开(公告)号：US09142797B2
公开(公告)日：2015-09-22
申请号：US14481924
申请日：2014-09-10
Applicant: Industrial Technology Research Institute
Inventor： Hsiao-Fen Wei , Liang-You Jiang , Pao-Ming Tsai , Yu-Yang Chang
IPC: H01L51/52 , H05B33/04 , B32B7/02 , B32B17/00 , B32B9/00 , B32B15/085 , B32B15/09 , B32B37/00 , B32B38/10 , B32B38/00 , B32B37/24
CPC classification number: H01L51/524 , B32B3/04 , B32B7/02 , B32B9/005 , B32B15/085 , B32B15/09 , B32B17/00 , B32B27/281 , B32B37/025 , B32B38/0004 , B32B38/10 , B32B2037/243 , B32B2307/7242 , B32B2307/7246 , B32B2439/00 , B32B2457/00 , B32B2457/20 , B32B2457/206 , B32B2457/208 , H01L51/5253 , H01L51/5256 , H01L2251/5338 , Y10T428/24488 , Y10T428/24521
Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
Abstract translation: 提供了包括第一阻气层，衬底和第二阻气层的阻气性衬底。 第一阻气层具有与基板结合的中心粘合表面和围绕中心粘结表面的周边编织表面。 第二阻气层完全覆盖基板和第一阻气层。 所述第二阻气层与所述基板和所述第一阻气层的周边配附面接合，其中，从所述基板的边缘到所述第一阻气层的边缘的最小距离大于所述第一气体阻隔层的厚度 阻挡层。
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公开(公告)号：US09023448B2
公开(公告)日：2015-05-05
申请号：US13774104
申请日：2013-02-22
Applicant: Industrial Technology Research Institute
Inventor： Pei-Ju Su , Pao-Ming Tsai , Liang-You Jiang , Chyi-Ming Leu
CPC classification number: B32B7/06 , C03C17/3405 , C03C2218/34 , C03C2218/355 , G09F3/02 , H05K1/0393 , Y10T428/1476
Abstract: A substrate structure applied in flexible devices is provided. The substrate structure includes a carrier; a release layer with a first area formed on the carrier, which has a first adhesion force to the carrier; and a flexible substrate with a second area overlying part of the first area of the release layer and contacting the carrier, which has a second adhesion force to the release layer and a third adhesion force to the carrier, wherein the first area is larger than or equal to the second area, the third adhesion force is greater than the first adhesion force, and the first adhesion force is greater than the second adhesion force.
Abstract translation: 提供了一种应用在柔性器件中的衬底结构。 衬底结构包括载体; 释放层，其具有形成在所述载体上的第一区域，所述第一区域对所述载体具有第一粘附力; 以及柔性基底，其具有覆盖在所述释放层的所述第一区域的一部分上的第二区域并使所述载体接触，所述载体对所述释放层具有第二粘附力和对所述载体的第三粘附力，其中所述第一区域大于或 等于第二区域，第三粘附力大于第一粘附力，并且第一粘附力大于第二粘附力。
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公开(公告)号：US08932804B1
公开(公告)日：2015-01-13
申请号：US14487037
申请日：2014-09-15
Applicant: Industrial Technology Research Institute
Inventor： Pao-Ming Tsai , Yu-Yang Chang , Liang-You Jiang , Yu-Jen Chen
CPC classification number: G03F7/343 , G02F1/00 , G02F1/133305 , G03F7/2016 , G03F7/34
Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.
Abstract translation: 本发明提供了一种用于图案化柔性基板的方法。 图案化柔性基板的方法包括提供载体基板。 在载体基板上形成剥离层。 在剥离层上形成柔性基材膜。 形成多个UV阻挡掩模图案，覆盖柔性基底膜和释放层的各个部分。 执行紫外线照射工艺以将柔性基底膜和未被UV阻挡掩模图案覆盖的剥离层暴露于UV光。 进行剥离步骤，使得柔性基材薄膜的不暴露于紫外光的各个部分的正上方的各个部分与载体基板分离。
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公开(公告)号：US20150004548A1
公开(公告)日：2015-01-01
申请号：US14487037
申请日：2014-09-15
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Pao-Ming Tsai , Yu-Yang Chang , Liang-You Jiang , Yu-Jen Chen
CPC classification number: G03F7/343 , G02F1/00 , G02F1/133305 , G03F7/2016 , G03F7/34
Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.
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Patent Agency Ranking
公开(公告)号：US20140374736A1
公开(公告)日：2014-12-25
申请号：US14481924
申请日：2014-09-10
Applicant: Industrial Technology Research Institute
Inventor： Hsiao-Fen Wei , Liang-You Jiang , Pao-Ming Tsai , Yu-Yang Chang
CPC classification number: H01L51/524 , B32B3/04 , B32B7/02 , B32B9/005 , B32B15/085 , B32B15/09 , B32B17/00 , B32B27/281 , B32B37/025 , B32B38/0004 , B32B38/10 , B32B2037/243 , B32B2307/7242 , B32B2307/7246 , B32B2439/00 , B32B2457/00 , B32B2457/20 , B32B2457/206 , B32B2457/208 , H01L51/5253 , H01L51/5256 , H01L2251/5338 , Y10T428/24488 , Y10T428/24521
Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
Abstract translation: 提供了包括第一阻气层，衬底和第二阻气层的阻气性衬底。 第一阻气层具有与基板结合的中心粘合表面和围绕中心粘结表面的周边编织表面。 第二阻气层完全覆盖基板和第一阻气层。 所述第二阻气层与所述基板和所述第一阻气层的周边配附面接合，其中，从所述基板的边缘到所述第一阻气层的边缘的最小距离大于所述第一气体阻隔层的厚度 阻挡层。
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公开(公告)号：US09957362B2
公开(公告)日：2018-05-01
申请号：US14720833
申请日：2015-05-24
Applicant: Industrial Technology Research Institute
Inventor： Hsiao-Fen Wei , Liang-You Jiang , Pao-Ming Tsai , Jhen-Hao Jiang
IPC: B32B3/02 , B32B9/00 , B32B3/00 , B05D1/36 , B05D1/40 , B32B3/10 , B32B7/00 , B32B7/04 , B32B3/26 , C08J7/04 , B05D7/00
CPC classification number: C08J7/045 , B05D7/56 , B32B3/10 , B32B3/263 , B32B7/005 , B32B7/045 , B32B2307/7242 , C08J7/04 , C08J2379/08 , C08J2427/00 , C08J2433/08 , Y10T428/24752 , Y10T428/24851
Abstract: The present invention employs the printable process to fabricate a multi-layered laminate gas barrier film. According to an embodiment of the present invention, after providing a plastic substrate, a first organic layer is printed with a first pattern on the plastic substrate. A first inorganic layer is printed to the first organic layer, filling up openings within the first pattern of the first organic layer and covering a surface of the first organic layer. A second organic layer is printed with a second pattern on the first inorganic layer. A second inorganic layer is printed to the second organic layer, filling up openings within the second pattern of the second organic layer and covering a surface of the second organic layer.
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公开(公告)号：US20150004549A1
公开(公告)日：2015-01-01
申请号：US14487047
申请日：2014-09-15
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor： Pao-Ming Tsai , Yu-Yang Chang , Liang-You Jiang , Yu-Jen Chen
CPC classification number: G03F7/343 , G02F1/00 , G02F1/133305 , G03F7/2016 , G03F7/34
Abstract: The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.
Abstract translation: 本发明提供了一种用于图案化柔性基板的方法。 图案化柔性基板的方法包括提供载体基板。 在载体基板上形成剥离层。 在剥离层上形成柔性基材膜。 形成多个UV阻挡掩模图案，覆盖柔性基底膜和释放层的各个部分。 执行紫外线照射工艺以将柔性基底膜和未被UV阻挡掩模图案覆盖的剥离层暴露于UV光。 进行剥离步骤，使得柔性基材薄膜的不暴露于紫外光的各个部分的正上方的各个部分与载体基板分离。
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9.发明申请FABRICATING MEHTOD OF GAS BARRIER SUBSTRATE, ORGANIC ELECTRO-LUMINESCENT DEVICE AND PACKAGING METHOD THEREOF 有权有机电致发光器件制造气体基板的制造方法及其包装方法公开(公告)号：US20130295814A1
公开(公告)日：2013-11-07
申请号：US13895379
申请日：2013-05-16
Applicant: Industrial Technology Research Institute
Inventor： Hsiao-Fen Wei , Liang-You Jiang , Pao-Ming Tsai , Yu-Yang Chang
CPC classification number: H05B33/04 , B32B15/085 , B32B15/09 , B32B37/025 , B32B38/0004 , B32B38/10 , B32B2037/243 , B32B2457/20 , B32B2457/206 , B32B2457/208 , H01L51/524 , H01L51/5253 , H01L51/5256 , H05B33/10 , Y10T156/10 , Y10T428/239
Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.
Abstract translation: 提供了包括第一阻气层，衬底和第二阻气层的阻气性衬底。 第一阻气层具有与基板结合的中心粘合表面和围绕中心粘结表面的周边编织表面。 第二阻气层完全覆盖基板和第一阻气层。 所述第二阻气层与所述基板和所述第一阻气层的周边配附面接合，其中，从所述基板的边缘到所述第一阻气层的边缘的最小距离大于所述第一气体阻隔层的厚度 阻挡层。
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公开(公告)号：US20170162827A1
公开(公告)日：2017-06-08
申请号：US15437454
申请日：2017-02-21
Applicant: Industrial Technology Research Institute
Inventor： Hsiao-Fen Wei , Liang-You Jiang
CPC classification number: H01L51/5256 , H01J1/88 , H01L51/0097 , H01L51/524 , H01L51/5246 , Y02E10/549 , Y10T428/239 , Y10T428/24529 , Y10T428/2495
Abstract: A substrate structure including a bottom organic layer, at least one inorganic layer, at least one organic layer and at least one protruding object is provided. The at least one protruding object is protruded from an upper surface of the bottom organic layer or the organic layer. A maximum height of the protruding object protruded from the upper surface of the bottom organic layer or the organic layer is H, and a thickness of the organic layer covering the protruding object is T, wherein T≧1.1H.
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