公开(公告)号：US20150371935A1

公开(公告)日：2015-12-24

申请号：US14311431

申请日：2014-06-23

Applicant: Infineon Technologies Austria AG

Inventor： Martin STANDING ,  Andrew ROBERTS

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/768 ,  H01L21/78 ,  H01L21/48

CPC classification number: H01L21/4857 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/24011 ,  H01L2224/24101 ,  H01L2224/24227 ,  H01L2224/82031 ,  H01L2224/82101 ,  H01L2224/97 ,  H01L2924/01029 ,  H05K1/184 ,  H05K1/186 ,  H05K2201/10166 ,  H05K3/4661 ,  H01L2924/00014 ,  H01L2224/82

Abstract: Representative implementations of devices and techniques provide a semiconductor package comprising a laminate substrate. The laminate substrate includes at least one conductive layer laminated to a surface of an insulating core. The laminate substrate also includes one or more die openings, in which one or more semiconductor die are located.

Abstract translation: 设备和技术的代表性实现提供了包括层压基板的半导体封装。 层叠基板包括层压到绝缘芯的表面上的至少一个导电层。 层压基板还包括一个或多个模具开口，其中一个或多个半导体管芯位于其中。

公开(公告)号：US20140111951A1

公开(公告)日：2014-04-24

申请号：US13654450

申请日：2012-10-18

Applicant: INFINEON TECHNOLOGIES AUSTRIA AG

Inventor： Martin STANDING ,  Andrew ROBERTS

IPC: H05K1/18 ,  H05K3/20 ,  H05K1/11

CPC classification number: H05K1/0207 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/0265 ,  H05K1/186 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09545 ,  H05K2201/09609 ,  H05K2201/10166 ,  H05K2201/10416 ,  H05K2201/10492 ,  H05K2201/10515 ,  Y10T29/49128 ,  H01L2924/00

Abstract: Representative implementations of devices and techniques provide improved electrical performance of components, such as chip dice, for example, disposed on different layers of a multi-layer printed circuit board (PCB). In an example, the components may be embedded within layers of the PCB. An insulating layer located between two component layers or sets of layers includes a conductive portion that may be strategically located to provide electrical connectivity between the components. The conductive portion may also be arranged to improve thermal conductivity between points of the PCB.

Abstract translation: 器件和技术的代表性实现提供了诸如设置在多层印刷电路板（PCB）的不同层上的部件（例如芯片）的改进的电性能。 在一个示例中，组件可以嵌入在PCB的层内。 位于两个组件层或层组之间的绝缘层包括可以被策略地定位以提供部件之间的电连接的导电部分。 导电部分也可以布置成改善PCB的点之间的热导率。