公开(公告)号：US20160078998A1

公开(公告)日：2016-03-17

申请号：US14856542

申请日：2015-09-16

Applicant: INNOCHIPS TECHNOLOGY CO., LTD.

Inventor： In Kil PARK ,  Tae Hyung NOH ,  Jun Ho JUNG ,  Gyeong Tae KIM ,  Seung Hun CHO ,  Young Tak KIM ,  Jong Pil PARK

IPC: H01F27/34 ,  H05K3/00 ,  H01F27/28 ,  H01F41/04 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K3/0094 ,  H01F17/0013 ,  H01F41/041 ,  H01F2027/2809 ,  H01L23/5227 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/115 ,  H05K2201/09545 ,  H05K2201/09781 ,  H01L2924/00

Abstract: Provided is a circuit protection device and a method of manufacturing the same including forming a plating lead line and a first coil pattern connected to the plating lead line on a substrate, forming an insulating layer on the first coil pattern and then forming a via hole exposing a portion of the first coil pattern, applying power through a plating lead line to form a via plug filling the via hole from the first coil pattern, and forming a second coil pattern connected to the via plug at an upper portion of the insulating layer.

Abstract translation: 提供了一种电路保护装置及其制造方法，包括在基板上形成连接到电镀引线的电镀引线和第一线圈图案，在第一线圈图案上形成绝缘层，然后形成通孔露出 第一线圈图案的一部分，通过电镀引线施加电力，以形成从第一线圈图案填充通孔的通孔，并且在绝缘层的上部形成连接到通孔塞的第二线圈图案。

公开(公告)号：US20180139827A1

公开(公告)日：2018-05-17

申请号：US15571849

申请日：2016-05-04

Applicant: MODA-INNOCHIPS TECHNOLOGY CO., LTD.

Inventor： Seung Hun CHO ,  Sung Jin HEO ,  Dong Suk LEE

IPC: H05F3/04 ,  H01G4/30 ,  H01G4/12 ,  H01G4/005

CPC classification number: H05F3/04 ,  H01C7/12 ,  H01G2/14 ,  H01G4/002 ,  H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1209 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H01G4/33 ,  H01G4/40 ,  H04B1/3888 ,  H04M1/0202 ,  H05F3/02

Abstract: Provided are a device for preventing an electric shock and an electronic device including the same. The device for preventing the electric shock includes a stacked body in which a plurality of insulation sheets are stacked, a capacitor part including a plurality of internal electrodes disposed in the stacked body, an ESD protection part disposed in the stacked body and including at least two or more discharge electrodes and at least one ESD protection layer disposed between the discharge electrodes, and an external electrode disposed on each of at least two side surfaces outside the stacked body and connected to the capacitor part and the ESD protection part. At least one region of the ESD protection layer has a thickness and width of which at least one is different from that of the other region.