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公开(公告)号：US20160052020A1
公开(公告)日：2016-02-25
申请号：US14710581
申请日：2015-05-12
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Sung Cheol PARK , Young Sul KIM , Kyung Seob YOON , Hee Seob SHIN , In Seob JUNG
IPC: B06B1/06
CPC classification number: B06B1/0607 , B06B1/0603
Abstract: Provided is a piezoelectric device including a first piezoelectric plate, a vibration plate provided to contact one surface of the first piezoelectric plate, and at least one second piezoelectric plate provided to contact the vibration plate, wherein the first and second piezoelectric plates have different resonant frequencies.
Abstract translation: 提供一种压电装置，其包括第一压电板，设置成接触第一压电板的一个表面的振动板和设置成接触振动板的至少一个第二压电板，其中第一和第二压电板具有不同的谐振频率 。
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公开(公告)号：US20160078998A1
公开(公告)日：2016-03-17
申请号：US14856542
申请日：2015-09-16
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Jun Ho JUNG , Gyeong Tae KIM , Seung Hun CHO , Young Tak KIM , Jong Pil PARK
CPC classification number: H05K3/0094 , H01F17/0013 , H01F41/041 , H01F2027/2809 , H01L23/5227 , H01L2924/0002 , H05K1/0298 , H05K1/115 , H05K2201/09545 , H05K2201/09781 , H01L2924/00
Abstract: Provided is a circuit protection device and a method of manufacturing the same including forming a plating lead line and a first coil pattern connected to the plating lead line on a substrate, forming an insulating layer on the first coil pattern and then forming a via hole exposing a portion of the first coil pattern, applying power through a plating lead line to form a via plug filling the via hole from the first coil pattern, and forming a second coil pattern connected to the via plug at an upper portion of the insulating layer.
Abstract translation: 提供了一种电路保护装置及其制造方法，包括在基板上形成连接到电镀引线的电镀引线和第一线圈图案，在第一线圈图案上形成绝缘层，然后形成通孔露出 第一线圈图案的一部分，通过电镀引线施加电力，以形成从第一线圈图案填充通孔的通孔，并且在绝缘层的上部形成连接到通孔塞的第二线圈图案。
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公开(公告)号：US20150285772A1
公开(公告)日：2015-10-08
申请号：US14678980
申请日：2015-04-04
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Sung Cheol PARK , Ki Beom KWON , Seung Hwan LEE , Jun Ho JUNG
IPC: G01N33/00
CPC classification number: G01N33/0031 , G01N27/123
Abstract: Disclosed is a sensor device including a plurality of substrates vertically stacked, a plurality of heaters formed on at least one selected substrate and separated from each other in a horizontal direction, a plurality of sensing electrodes formed at least one selected substrate on a top portion of the substrate on which the plurality of heaters are formed and separated in the horizontal direction, and a plurality of materials configured to respectively contact the plurality of sensing electrodes and formed separately from each other.
Abstract translation: 公开了一种传感器装置，其包括垂直堆叠的多个基板，形成在至少一个所选择的基板上并在水平方向上彼此分离的多个加热器，多个感测电极在至少一个选定的基板上形成 其上形成有多个加热器并在水平方向上分离的基板，以及分别与多个感测电极分别接触并且彼此分开形成的多个材料。
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公开(公告)号：US20160007498A1
公开(公告)日：2016-01-07
申请号：US14791367
申请日：2015-07-03
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Dae Kyum KIM
IPC: H05K7/20
CPC classification number: H05K7/2039 , B32B7/12 , B32B15/046 , B32B2307/302 , C09J7/26 , C09J7/35 , F28F13/18 , G06F1/20 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L23/42 , H01L2924/0002 , H01L2924/00
Abstract: Provided is a heat-radiating sheet including a heat-radiating layer having a porous structure with multiple pores, a filler including multiple thermally conductive particles and filling the pores inside the heat-radiating layer, and an adhesive layer disposed on at least one surface of the heat-radiating layer.
Abstract translation: 本发明提供一种散热片，其具有具有多孔结构的多孔结构的散热层，具有多个导热性粒子的填充物，填充上述散热层内部的孔，并且设置在该散热片的至少一个表面上 散热层。
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公开(公告)号：US20150285754A1
公开(公告)日：2015-10-08
申请号：US14678981
申请日：2015-04-04
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Sung Cheol PARK , Ki Beom KWON , Seung Hwan LEE , Jun Ho JUNG
IPC: G01N27/12
CPC classification number: G01N27/12
Abstract: Provided is a sensor including an insulating layer, at least two heater patterns separated in one direction in the insulating layer and electrically connected to each other, at least two sensing electrode patterns insulated form the heater patterns, separated in the one direction in the insulating layer, and electrically connected to each other, and a sensing material, at least a part of which is buried in the insulating layer to contact the sensing electrode patterns.
Abstract translation: 提供了一种传感器，其包括绝缘层，至少两个在绝缘层中的一个方向上分离并彼此电连接的加热器图案，至少两个从加热器图案绝缘的感测电极图案，其在绝缘层中沿一个方向分离 并且彼此电连接，以及感测材料，其至少一部分被埋在绝缘层中以接触感测电极图案。
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Patent Agency Ranking
公开(公告)号：US20160052018A1
公开(公告)日：2016-02-25
申请号：US14710572
申请日：2015-05-12
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Sung Cheol PARK , Young Sul KIM , Kyung Seob YOON , Hee Seob SHIN , In Seob JUNG
CPC classification number: H01L41/09 , B06B1/0618 , H01L41/053
Abstract: Provided is a piezoelectric device including at least two piezoelectric plates configured to include at two contact points, wherein the at least two piezoelectric plates include at least two resonant frequencies. The piezoelectric device in a wearable device operates as at least any one of a piezoelectric sound device and a piezoelectric vibration device.
Abstract translation: 提供一种压电装置，其包括至少两个压电板，其被配置为包括在两个接触点处，其中所述至少两个压电板包括至少两个谐振频率。 耐磨装置中的压电装置作为压电声音装置和压电振动装置中的至少任一个而工作。
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7.发明申请公开(公告)号：US20150122575A1
公开(公告)日：2015-05-07
申请号：US14530649
申请日：2014-10-31
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Sung Cheol PARK , Young Sul KIM , Soon Dong CHOI , In Seob JUNG , Wan PARK
CPC classification number: G10K11/04 , A45C11/00 , H04M1/035 , H04M1/04 , H04M1/185 , H04M1/6016 , H04R1/2811 , H04R17/00 , H04R2201/029 , H04R2205/021 , H04R2217/00 , H04R2499/11
Abstract: Provided are a sound amplification box and a sound amplification device. The sound amplification box includes a body including a predetermined resonance space therein and having a surface contacting an electronic device, a resonance hole formed in at least one surface of the body, and a vibration transmission part in a predetermined region of the surface contacting the electronic device.
Abstract translation: 提供了声音放大盒和声音放大装置。 声音放大盒包括：主体，其内部具有预定的共振空间，并且具有与电子设备接触的表面;形成在主体的至少一个表面中的共鸣孔;以及在与电子接触的表面的预定区域中的振动传播部分 设备。
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公开(公告)号：US20140347773A1
公开(公告)日：2014-11-27
申请号：US14281845
申请日：2014-05-19
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Gyeong-Tae KIM , Myung Ho LEE , Jung Hun LEE , Euy Ho SHIN , Jin Hwan KIM , Song Yeon LEE
CPC classification number: H02H9/005 , H03H7/0115 , H03H2001/0085
Abstract: Provided is a circuit protection device including a plurality of sheets selectively formed with at least one coil pattern, at least one withdrawal electrode, at least one hole filled with a conductive material, and at least one capacitor electrode and at least two inductors and at least two capacitors, in which the at least one coil pattern forms one inductor and a capacitor is formed between the capacitor electrode and the coil pattern.
Abstract translation: 提供一种电路保护装置，其包括选择性地形成有至少一个线圈图案的多个片材，至少一个取出电极，填充有导电材料的至少一个孔，以及至少一个电容器电极和至少两个电感器，并且至少 两个电容器，其中至少一个线圈图案形成一个电感器，并且电容器形成在电容器电极和线圈图案之间。
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公开(公告)号：US20170133142A1
公开(公告)日：2017-05-11
申请号：US14986447
申请日：2015-12-31
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Myung Ho LEE , Song Yeon LEE , Jung Hun LEE , Hyun Mo KANG
CPC classification number: H01F17/0013 , H01F19/04 , H01F27/24 , H01F27/29 , H01F27/292 , H01F2017/0093 , H02H9/04 , H03H1/0007 , H03H7/01 , H03H2001/0085
Abstract: The present disclosure includes: a laminate in which a plurality of sheets are laminated; two or more noise filters provided spaced apart by a predetermined distance from each other in the laminate and respectively provided with a plurality of coil patterns; an external electrode provided outside the laminate and connected to the two or more noise filters; and a connection electrode provided outside the laminate being spaced apart from the external electrode to connect the two or more coil patterns.
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公开(公告)号：US20160276995A1
公开(公告)日：2016-09-22
申请号：US15073622
申请日：2016-03-17
Applicant: INNOCHIPS TECHNOLOGY CO., LTD.
Inventor： In Kil PARK , Tae Hyung NOH , Gyeong Tae KIM , Myung Ho LEE , Tae Geun SEO , Min Soo LEE , Song Yeon LEE
CPC classification number: H03H1/00 , H01F17/0013 , H01F27/2804 , H01F2017/002 , H01F2017/0026 , H01F2027/2809 , H01G4/005 , H01G4/232 , H01G4/30 , H01G4/40 , H03H7/0115 , H03H2001/0085
Abstract: Provided is a laminated chip device including a first laminate in which a plurality of conductor patterns formed on a plurality of sheets are connected to each other through a via formed to penetrate at least a sheet, and a second laminate provided over or below the first laminate and having a plurality of internal electrode patterns formed on a plurality of sheets, and the internal electrode patterns have a non-conductive region in at least a portion of an area corresponding to the via.
Abstract translation: 提供了一种层叠芯片装置，其包括：第一层压体，其中形成在多个片材上的多个导体图案通过形成为穿透至少一个片材的通孔彼此连接;以及第二层压体，其设置在第一层压体上方或下方 并且具有形成在多个片材上的多个内部电极图案，并且内部电极图案在与通孔对应的区域的至少一部分中具有非导电区域。
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