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公开(公告)号：US10749261B2
公开(公告)日：2020-08-18
申请号：US15607378
申请日：2017-05-26
Applicant: Intel Corporation
Inventor： Songnan Yang , Hao-Han Hsu , Ulun Karacaoglu , Anand S. Konanur , Yee Wei Eric Hong
Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
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公开(公告)号：US10454163B2
公开(公告)日：2019-10-22
申请号：US15713286
申请日：2017-09-22
Applicant: Intel Corporation
Inventor： JaeJin Lee , Dong-Ho Han , Hao-Han Hsu
Abstract: Embodiments include apparatuses, methods, and systems including an electronic apparatus including an inductor within a circuit package affixed to a printed circuit board (PCB) having a ground layer, where the ground layer includes a mesh area that is substantially void along a contour of the inductor. An electronic apparatus may include a circuit package with an inductor, and a PCB, where the circuit package may be affixed to the PCB. The PCB may have a plurality of layers including a ground layer and a power layer, where the ground layer may be between the power layer and the inductor. The ground layer may include a mesh area that may be substantially void along a contour of the inductor within the circuit package. Other embodiments may also be described and claimed.
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公开(公告)号：US20190115281A1
公开(公告)日：2019-04-18
申请号：US16215228
申请日：2018-12-10
Applicant: Intel Corporation
Inventor： Jaejin Lee , Hao-Han Hsu
IPC: H01L23/40 , H01L23/427 , H01F7/02
Abstract: There is disclosed in one example a computing apparatus, including: an active computing element; a first magnetic attractor mechanically coupled to the active computing element; and a cold plate disposed to conduct heat away from the active computing element, the cold plate including a second magnetic attractor disposed to magnetically couple with the first magnetic attractor.
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公开(公告)号：US09954385B2
公开(公告)日：2018-04-24
申请号：US14757912
申请日：2015-12-24
Applicant: Intel Corporation
Inventor： Jonathan Rosenfeld , Geoffrey Jensen , Patrick W. Chewning , Sean L. Molloy , Hao-Han Hsu , Songnan Yang
CPC classification number: H02J7/025 , H02J7/0042 , H02J50/12
Abstract: A computing device includes a charging coil for producing a charging current when placed in a magnetic field of a wireless power transmitter. A wireless charging operating frequency is associated with wireless charging of a battery of the computing device by the charging coil and the wireless power transmitter. An electrically conductive substrate has a plurality of gaps for reducing eddy currents when the electrically conductive substrate is disposed between the charging coil and the wireless power transmitter during charging of the battery. A plurality of filters each electrically bridge a respective one of the gaps. Each filter attenuates signals within a range of frequencies including the wireless charging operating frequency.
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公开(公告)号：US09812804B2
公开(公告)日：2017-11-07
申请号：US14227009
申请日：2014-03-27
Applicant: Intel Corporation
Inventor： Hao-Han Hsu , Yun Ling , Xiang Li
IPC: G01R31/20 , H01R13/24 , H01R13/6583 , H01R12/72 , H01R13/453
CPC classification number: H01R13/2421 , H01R12/724 , H01R13/4538 , H01R13/6583 , H01R2201/06 , Y10T29/49222
Abstract: In accordance with some embodiments, a high speed connection may be implemented using pogo-pins. The use of pogo-pins may be advantageous because accurate alignment is not required, connection force is generally lower than with other connections and appearance is often highly advantageous. Through the use of a moveable metal shield, an advantageous high speed connection for high speed signaling may be implemented between the two devices.
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Patent Agency Ranking
公开(公告)号：US11283173B2
公开(公告)日：2022-03-22
申请号：US16993387
申请日：2020-08-14
Applicant: Intel Corporation
Inventor： Songnan Yang , Hao-Han Hsu , Ulun Karacaoglu , Anand Konanur , Yee Wei Eric Hong
Abstract: Described herein are techniques related one or more systems, apparatuses, methods, etc. for integrating a near field communications (NFC) coil antenna in a portable device. For example, the NFC antenna is integrated under a metal chassis of the portable device. The metal chassis and a conductive coating—that is integrated underneath the full metal chassis—are designed to include one or more slots to provide high impedance to Eddy current induced in the conductive coating.
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公开(公告)号：US10403581B2
公开(公告)日：2019-09-03
申请号：US15721729
申请日：2017-09-29
Applicant: Intel Corporation
Inventor： Jaejin Lee , Hao-Han Hsu , Chung-Hao J. Chen , Dong-Ho Han
IPC: H01L23/552 , H01L21/48 , H01L23/498 , H01L21/56 , H01L23/14 , H01L23/31 , H01L21/02 , H05K1/02 , H01L23/66 , H01L23/00 , H01L23/16
Abstract: Electronic device packages utilizing a stiffener coupled to a substrate with a magnetic lossy bonding layer to attenuate or absorb electromagnetic signals such as radio frequency interference (RFI) along with related systems and method are disclosed.
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公开(公告)号：US20190103366A1
公开(公告)日：2019-04-04
申请号：US15721729
申请日：2017-09-29
Applicant: Intel Corporation
Inventor： Jaejin Lee , Hao-Han Hsu , Chung-Hao J. Chen , Dong-Ho Han
IPC: H01L23/552 , H01L21/56 , H01L23/14 , H01L23/31 , H01L21/48 , H01L21/02 , H05K1/02 , H01L23/498
CPC classification number: H01L23/552 , H01L21/02227 , H01L21/4857 , H01L21/563 , H01L23/142 , H01L23/16 , H01L23/3114 , H01L23/49838 , H01L23/562 , H01L23/66 , H01L2223/6677 , H01L2924/10253 , H01L2924/14 , H01L2924/153 , H01L2924/15311 , H01L2924/3025 , H01L2924/3511 , H05K1/0271
Abstract: Electronic device packages utilizing a stiffener coupled to a substrate with a magnetic lossy bonding layer to attenuate or absorb electromagnetic signals such as radio frequency interference (RFI) along with related systems and method are disclosed.
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公开(公告)号：US20190097313A1
公开(公告)日：2019-03-28
申请号：US15713286
申请日：2017-09-22
Applicant: Intel Corporation
Inventor： JaeJin Lee , Dong-Ho Han , Hao-Han Hsu
CPC classification number: H01Q1/52 , H01Q1/242 , H01Q1/273 , H01Q1/38 , H01Q1/48 , H05K1/0225 , H05K3/3436 , H05K2201/09681 , H05K2201/10098
Abstract: Embodiments include apparatuses, methods, and systems including an electronic apparatus including an inductor within a circuit package affixed to a printed circuit board (PCB) having a ground layer, where the ground layer includes a mesh area that is substantially void along a contour of the inductor. An electronic apparatus may include a circuit package with an inductor, and a PCB, where the circuit package may be affixed to the PCB. The PCB may have a plurality of layers including a ground layer and a power layer, where the ground layer may be between the power layer and the inductor. The ground layer may include a mesh area that may be substantially void along a contour of the inductor within the circuit package. Other embodiments may also be described and claimed.
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公开(公告)号：US20180287411A1
公开(公告)日：2018-10-04
申请号：US15478501
申请日：2017-04-04
Applicant: INTEL CORPORATION
Inventor： Jaejin Lee , Hao-Han Hsu , Chung-Hao J. Chen
Abstract: Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a ferrite structure disposed below the transmit coil, the ferrite structure comprising a flat sheet and a projection of ferrite material projecting above the flat sheet.
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