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公开(公告)号：US20160293898A1
公开(公告)日：2016-10-06
申请号：US14953428
申请日：2015-11-30
Applicant: Industrial Technology Research Institute
Inventor： Jyun-Kai Ciou , Chao-Feng Sung , Ting-Yu Ke , Hsin-Yun Hsu , Cheng-Yi Chen , Yung-Min Hsieh
CPC classification number: H01L51/56 , H01L51/0011 , H01L51/0023 , H01L2251/5338
Abstract: A method for fabricating an organic electro-luminescence device, comprising: forming a first conductive layer comprising a first electrode and a contact pattern on a substrate; foil ling a first mask on the first conductive layer, the first mask comprising an opening for exposing a portion of the first electrode and a portion of the contact pattern; forming a patterned organic functional layer by shielding of a second mask, the patterned organic functional layer covering the first mask and the first electrode exposed by the first mask, and the second mask being disposed over the first mask to shield the portion of the contact pattern exposed by the opening; forming a second conductive layer and patterning the second conductive layer by removing the first mask and a portion of the second conductive layer on the first mask to form a second electrode electrically connected to the contact pattern.
Abstract translation: 一种制造有机电致发光器件的方法，包括：在衬底上形成包括第一电极和接触图案的第一导电层; 在第一导电层上形成第一掩模，第一掩模包括用于暴露第一电极的一部分和接触图案的一部分的开口; 通过屏蔽第二掩模来形成图案化的有机功能层，覆盖第一掩模的图案化有机功能层和由第一掩模曝光的第一电极，并且第二掩模设置在第一掩模上以屏蔽接触图案的部分 露出露面; 形成第二导电层并通过去除第一掩模上的第一掩模和第二导电层的一部分来形成第二导电层，以形成电连接到接触图案的第二电极。
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Patent Agency Ranking
公开(公告)号：US11729905B2
公开(公告)日：2023-08-15
申请号：US17221717
申请日：2021-04-02
Applicant: Industrial Technology Research Institute
Inventor： Yu-Lin Hsu , Hung-Hsien Ko , Ting-Yu Ke , Ting-Yu Wang
CPC classification number: H05K1/0283 , H05K3/0005 , H05K2201/055
Abstract: A stretchable circuit is provided in the invention. The stretchable circuit comprises a plurality of segments. Each segment includes a plurality of sub-segments. Each sub-segment includes at least one main line, at least one secondary line, and rib lines, and in each sub-segment, the main lines and the secondary lines are electrically connected to the rib lines.
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公开(公告)号：US09882173B2
公开(公告)日：2018-01-30
申请号：US14953428
申请日：2015-11-30
Applicant: Industrial Technology Research Institute
Inventor： Jyun-Kai Ciou , Chao-Feng Sung , Ting-Yu Ke , Hsin-Yun Hsu , Cheng-Yi Chen , Yung-Min Hsieh
CPC classification number: H01L51/56 , H01L51/0011 , H01L51/0023 , H01L2251/5338
Abstract: A method for fabricating an organic electro-luminescence device, comprising: forming a first conductive layer comprising a first electrode and a contact pattern on a substrate; foil ling a first mask on the first conductive layer, the first mask comprising an opening for exposing a portion of the first electrode and a portion of the contact pattern; forming a patterned organic functional layer by shielding of a second mask, the patterned organic functional layer covering the first mask and the first electrode exposed by the first mask, and the second mask being disposed over the first mask to shield the portion of the contact pattern exposed by the opening; forming a second conductive layer and patterning the second conductive layer by removing the first mask and a portion of the second conductive layer on the first mask to form a second electrode electrically connected to the contact pattern.
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公开(公告)号：US12238864B2
公开(公告)日：2025-02-25
申请号：US17702814
申请日：2022-03-24
Applicant: Industrial Technology Research Institute
Inventor： Yu-Lin Hsu , Kuan-Chu Wu , Ting-Yu Ke , Min-Hsiung Liang , Yu-Ming Peng
Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.
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公开(公告)号：US20230199961A1
公开(公告)日：2023-06-22
申请号：US17702814
申请日：2022-03-24
Applicant: Industrial Technology Research Institute
Inventor： Yu-Lin Hsu , Kuan-Chu Wu , Ting-Yu Ke , Min-Hsiung Liang , Yu-Ming Peng
IPC: H05K1/11 , H01L23/538 , H01L23/13 , H05K3/00 , H01L21/48
CPC classification number: H05K1/119 , H01L23/5386 , H01L23/13 , H05K3/0014 , H01L21/4846 , H05K2201/09018 , H05K2201/09118 , H01L23/3121
Abstract: An electronic apparatus including a compression molding board and a connection pad is provided. The compression molding board has a device bonding area and a bending area formed by compression molding. The device bonding area is different from the bending area. The connection pad is disposed on the device bonding area of the compression molding board.
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公开(公告)号：US09969152B2
公开(公告)日：2018-05-15
申请号：US15071208
申请日：2016-03-16
Inventor： Yasuo Yamazaki , Takahide Fujii , Chun-Hsien Chien , Chia-Sheng Huang , Ting-Yu Ke , Hsin-Yun Hsu
CPC classification number: B32B43/006 , B32B7/06 , B32B17/06 , B32B37/06 , B32B2309/02 , B32B2309/10 , B32B2309/105 , B32B2315/08 , B32B2457/20 , B32B2457/206 , H01L51/003 , H01L51/0096 , H01L51/0097 , H01L51/5246 , H01L2227/326 , H01L2251/5338 , Y02E10/549
Abstract: In a method of producing a glass substrate including a laminate preparing step of laminating a glass film 1 having flexibility and a support glass 2 supporting the same, to prepare a laminate 3; a process step of forming an organic EL device 4 on the glass film 1 in the laminate 3, involving heating; and a peeling step of peeling off the glass film 1 on which the organic EL device 4 is formed from the support glass 2 to obtain a glass substrate 5, a heating step of heating the glass film 1 and the support glass 2 is executed before execution of the laminate preparing step, and the glass film 1 and the support glass 2 are laminated in the condition that they are heated at the time of execution of the laminate preparing step.
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