公开(公告)号：US20230416078A1

公开(公告)日：2023-12-28

申请号：US18337176

申请日：2023-06-19

Applicant: Infineon Technologies AG

Inventor： Andreas Bogner ,  Christian Bretthauer ,  Abhiraj Basavanna

IPC: B81B3/00

CPC classification number: B81B3/0078 ,  B81B3/0021 ,  B81B2203/0127 ,  B81B2201/0242 ,  B81B2201/0285 ,  B81B2201/0235

Abstract: A semiconductor device has a deformable membrane, e.g., for the measurement of at least one of an acceleration, a vibration, or a pressure. The membrane has a supporting connection with a support structure which includes at least one elastic supporting connection. Also disclosed are a sensor device including the semiconductor device along with methods for manufacturing the semiconductor device and the sensor device.

公开(公告)号：US20230294976A1

公开(公告)日：2023-09-21

申请号：US18065978

申请日：2022-12-14

Applicant: Infineon Technologies AG

Inventor： Abhiraj Basavanna ,  Somu Goswami ,  Andreas Bogner

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0072 ,  B81C1/00666 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2201/0285 ,  B81B2203/0127

Abstract: A semiconductor device for use in a sensor device has a deformable membrane for the measurement of an acceleration, a vibration, or a pressure. The semiconductor device includes a deformable membrane having a membrane border; a structure holding the deformable membrane in correspondence of the membrane border; at least one electric contact to obtain an electric signal indicative of deformation of the deformable membrane; and mass elements suspended from the membrane.