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公开(公告)号：US12300759B2
公开(公告)日：2025-05-13
申请号：US17573044
申请日：2022-01-11
Applicant: Infineon Technologies AG
Inventor： Frank Singer , Oliver Hellmund , Brendan Holland , Matthias Sperl
Abstract: A method of manufacturing a micro-light-emitting diode display includes processing a wafer to form a plurality of functional chips integral with the wafer. A plurality of wafer tiles is defined in the wafer, wherein each wafer tile is composed of a cluster of functional chips. The wafer tiles are singulated by wafer dicing. A plurality of separate wafer tiles is bonded to a semiconductor wafer by hybrid bonding. The functional chips are singulated together with chips of the semiconductor wafer by dicing the bonded-together wafer tiles and semiconductor wafer.
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公开(公告)号：US20230369181A1
公开(公告)日：2023-11-16
申请号：US17743601
申请日：2022-05-13
Applicant: Infineon Technologies AG
Inventor： Thorsten Scharf , Frank Singer
IPC: H01L23/495 , H01L23/31
CPC classification number: H01L23/49534 , H01L23/49503 , H01L23/3142
Abstract: A method of forming a semiconductor package includes providing a first metal substrate; and mounting a stacked arrangement on the first metal substrate, the stacked arrangement comprising a semiconductor die, wherein mounting the stacked arrangement includes: providing a first layer of attachment material between the first metal substrate and the stacked arrangement; and providing a second layer of attachment material within the stacked arrangement at an interface with the semiconductor die, wherein at least one of the first and second layers of attachment material is a compressible layer that includes one or more elastomeric elements embedded within a matrix of solder material.
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公开(公告)号：US12191285B2
公开(公告)日：2025-01-07
申请号：US17523023
申请日：2021-11-10
Applicant: Infineon Technologies AG
Inventor： Dietrich Bonart , Frank Singer
Abstract: An optical projection device and a method of producing the optical projection device are described. The optical projection device includes: a plurality of LEDs (light-emitting diodes), the LEDs each including a semiconductor mesa laterally spaced apart from one another by a grid structure. Each of the semiconductor mesas includes an n-type material and a p-type material adjoining at least partly the n-type material. The grid structure at least partly laterally surrounds at least the n-type material of each of the semiconductor mesas. The grid structure includes a conductive material that electrically interconnects the n-type material of the semiconductor mesas. The grid structure is configured to block optical crosstalk between light emitted by the LEDs.
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公开(公告)号：US20230163107A1
公开(公告)日：2023-05-25
申请号：US17523023
申请日：2021-11-10
Applicant: Infineon Technologies AG
Inventor： Dietrich Bonart , Frank Singer
CPC classification number: H01L25/0753 , H01L25/167 , H01L33/44 , H01L33/60 , H01L33/0095 , H01L33/385 , H01L33/0093 , H01L33/405 , H01L2933/0016 , H01L2933/0025
Abstract: An optical projection device and a method of producing the optical projection device are described. The optical projection device includes: a plurality of LEDs (light-emitting diodes), the LEDs each including a semiconductor mesa laterally spaced apart from one another by a grid structure. Each of the semiconductor mesas includes an n-type material and a p-type material adjoining at least partly the n-type material. The grid structure at least partly laterally surrounds at least the n-type material of each of the semiconductor mesas. The grid structure includes a conductive material that electrically interconnects the n-type material of the semiconductor mesas. The grid structure is configured to block optical crosstalk between light emitted by the LEDs.
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公开(公告)号：US20250054843A1
公开(公告)日：2025-02-13
申请号：US18931698
申请日：2024-10-30
Applicant: Infineon Technologies AG
Inventor： Frank Singer , Marcus Böhm , Andreas Grassmann , Martin Gruber , Uwe Schindler
IPC: H01L23/495 , H01L21/48 , H01L21/56 , H01L23/31
Abstract: A package includes a carrier, an electronic component on the carrier, an encapsulant encapsulating at least part of the carrier and the electronic component, and at least one lead extending beyond the encapsulant and having a punched surface, wherein at least part of at least one side flank of the encapsulant has a sawn texture.
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Patent Agency Ranking
公开(公告)号：US12165959B2
公开(公告)日：2024-12-10
申请号：US17150739
申请日：2021-01-15
Applicant: Infineon Technologies AG
Inventor： Frank Singer , Marcus Boehm , Andreas Grassmann , Martin Gruber , Uwe Schindler
IPC: H01L23/495 , H01L21/48 , H01L21/56 , H01L23/31
Abstract: A package includes a carrier, an electronic component on the carrier, an encapsulant encapsulating at least part of the carrier and the electronic component, and at least one lead extending beyond the encapsulant and having a punched surface, wherein at least part of at least one side flank of the encapsulant has a sawn texture.
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公开(公告)号：US11710684B2
公开(公告)日：2023-07-25
申请号：US17070427
申请日：2020-10-14
Applicant: Infineon Technologies AG
Inventor： Frank Singer , Martin Gruber , Thorsten Meyer , Thorsten Scharf , Peter Strobel , Stefan Woetzel
IPC: H01L23/495 , H01L21/56 , H01L23/31 , H01L21/54 , H01L23/16
CPC classification number: H01L23/49575 , H01L21/54 , H01L21/56 , H01L23/16 , H01L23/31 , H01L23/49541
Abstract: A package is disclosed. In one example, the package comprises a substrate having at least one first recess on a front side and at least one second recess on a back side, wherein the substrate is separated into a plurality of separate substrate sections by the at least one first recess and the at least one second recess, an electronic component mounted on the front side of the substrate, and a single encapsulant filling at least part of the at least one first recess and at least part of the at least one second recess. The encapsulant fully circumferentially surrounds sidewalls of at least one of the substrate sections.
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公开(公告)号：US20220238751A1
公开(公告)日：2022-07-28
申请号：US17573044
申请日：2022-01-11
Applicant: Infineon Technologies AG
Inventor： Frank Singer , Oliver Hellmund , Brendan Holland , Matthias Sperl
Abstract: A method of manufacturing a micro-light-emitting diode display includes processing a wafer to form a plurality of functional chips integral with the wafer. A plurality of wafer tiles is defined in the wafer, wherein each wafer tile is composed of a cluster of functional chips. The wafer tiles are singulated by wafer dicing. A plurality of separate wafer tiles is bonded to a semiconductor wafer by hybrid bonding. The functional chips are singulated together with chips of the semiconductor wafer by dicing the bonded-together wafer tiles and semiconductor wafer.
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公开(公告)号：US20210111108A1
公开(公告)日：2021-04-15
申请号：US17070427
申请日：2020-10-14
Applicant: Infineon Technologies AG
Inventor： Frank Singer , Martin Gruber , Thorsten Meyer , Thorsten Scharf , Peter Strobel , Stefan Woetzel
IPC: H01L23/495 , H01L23/16 , H01L23/31 , H01L21/54 , H01L21/56
Abstract: A package is disclosed. In one example, the package comprises a substrate having at least one first recess on a front side and at least one second recess on a back side, wherein the substrate is separated into a plurality of separate substrate sections by the at least one first recess and the at least one second recess, an electronic component mounted on the front side of the substrate, and a single encapsulant filling at least part of the at least one first recess and at least part of the at least one second recess. The encapsulant fully circumferentially surrounds sidewalls of at least one of the substrate sections.
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公开(公告)号：US12249561B2
公开(公告)日：2025-03-11
申请号：US17743601
申请日：2022-05-13
Applicant: Infineon Technologies AG
Inventor： Thorsten Scharf , Frank Singer
IPC: H01L23/495 , H01L23/00 , H01L23/31 , H01L23/492 , H01L23/498 , H01L25/065
Abstract: A method of forming a semiconductor package includes providing a first metal substrate; and mounting a stacked arrangement on the first metal substrate, the stacked arrangement comprising a semiconductor die, wherein mounting the stacked arrangement includes: providing a first layer of attachment material between the first metal substrate and the stacked arrangement; and providing a second layer of attachment material within the stacked arrangement at an interface with the semiconductor die, wherein at least one of the first and second layers of attachment material is a compressible layer that includes one or more elastomeric elements embedded within a matrix of solder material.
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