公开(公告)号：US20240192809A1

公开(公告)日：2024-06-13

申请号：US18469010

申请日：2023-09-18

Applicant: Infineon Technologies AG

Inventor： Emanuel STOICESCU ,  Matthias EBERL ,  Mohanraj SOUNDARA PANDIAN ,  Klaus ELIAN ,  Costin BATRINU

IPC: G06F3/043 ,  G06F3/041

CPC classification number: G06F3/043 ,  G06F3/0416

Abstract: An ultrasonic touch sensor includes a touch structure having a touch surface with a plurality of sensitive areas, a pixel array of capacitive ultrasonic transducers, and a sensor circuit. Each pixel includes a respective ultrasonic transmitter and a respective ultrasonic receiver and is configured to monitor for a touch at a respective first sensitive area and at a respective second sensitive area. Moreover, each pixel is configured to generate a measurement signal that is representative of a first respective ultrasonic reflected wave reflected by the touch interface at the respective first sensitive area or that is representative of a second respective ultrasonic reflected wave reflected by the touch interface at the respective second sensitive area. The sensor circuit is configured to determine whether the measurement signal of a respective pixel corresponds to the respective first sensitive area or to the respective second sensitive area associated with the respective pixel.

公开(公告)号：US20250091858A1

公开(公告)日：2025-03-20

申请号：US18822580

申请日：2024-09-03

Applicant: Infineon Technologies AG

Inventor： Theresa LUTZ ,  Malika BELLA ,  Stephan Gerhard ALBERT ,  Andre BROCKMEIER ,  Mohanraj SOUNDARA PANDIAN ,  Thomas BEVER

IPC: B81B3/00 ,  B81C1/00

Abstract: A microelectromechanical system (MEMS) mirror device includes a frame that defines a frame cavity; a suspension assembly; and a mirror body coupled to the frame by the suspension assembly such that the mirror body is suspended over the frame cavity. The mirror body comprises a sandwich structure that includes a front plate, a back plate, and a hollow core assembly arranged between the front plate and the back plate. The front plate and the back plate define a thickness dimension of the mirror body. The hollow core assembly includes a plurality of support structures that extend between the front plate and the back plate and define a plurality of cavities between the front plate and the back plate.

公开(公告)号：US20240251683A1

公开(公告)日：2024-07-25

申请号：US18419033

申请日：2024-01-22

Applicant: Infineon Technologies AG

Inventor： Mohanraj SOUNDARA PANDIAN ,  Marten OLDSEN

IPC: H10N39/00 ,  B06B1/02 ,  B06B1/06

CPC classification number: H10N39/00 ,  B06B1/0292 ,  B06B1/0666

Abstract: Examples disclose an ultrasonic transducer including a set of transducer elements including a capacitive transducer element and a piezoelectric transducer element, wherein the capacitive transducer element and the piezoelectric transducer element are provided laterally separated in a same semiconductor die. Further examples disclose a method of manufacturing an ultrasonic transducer.