公开(公告)号：US20170062312A1

公开(公告)日：2017-03-02

申请号：US14839013

申请日：2015-08-28

Applicant: Infineon Technologies AG

Inventor： Volker Strutz ,  Rainer Schaller

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49582 ,  H01L23/49586 ,  H01L2224/32245 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor device package includes a leadframe and a semiconductor chip mounted to the leadframe. The semiconductor device package further includes a molded encapsulant configured to cast-in-place the leadframe. A surface area of the leadframe remains exposed by the encapsulant. An electrically insulating covering layer extends over a part of the surface area and is configured to divide the surface area in at least two zones.

Abstract translation: 半导体器件封装包括引线框架和安装到引线框架的半导体芯片。 半导体器件封装还包括被配置为将引线框投入就位的模制密封剂。 引线框架的表面区域由密封剂保持暴露。 电绝缘覆盖层在表面区域的一部分上延伸并且被配置为在至少两个区域中划分表面积。

公开(公告)号：US10168391B2

公开(公告)日：2019-01-01

申请号：US15049923

申请日：2016-02-22

Applicant: Infineon Technologies AG

Inventor： Giuliano Angelo Babulano ,  Jens Oetjen ,  Liu Chen ,  Toni Salminen ,  Stefan Mieslinger ,  Markus Dinkel ,  Martin Gruber ,  Franz Jost ,  Thorsten Meyer ,  Rainer Schaller

IPC: H01L25/16 ,  G01R33/00 ,  G01R33/09 ,  H01L43/08 ,  H01L43/02

Abstract: An interconnect module includes a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections. The first end section is configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier. The second end section is configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier. The module further includes a magnetic field sensor secured to the metal clip. The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip. The interconnect module can be used to form a direct electrical connection between components and/or metal regions of a carrier to which the module is attached.

公开(公告)号：US20160377689A1

公开(公告)日：2016-12-29

申请号：US15049923

申请日：2016-02-22

Applicant: Infineon Technologies AG

Inventor： Giuliano Angelo Babulano ,  Jens Oetjen ,  Liu Chen ,  Toni Salminen ,  Stefan Mieslinger ,  Markus Dinkel ,  Martin Gruber ,  Franz Jost ,  Thorsten Meyer ,  Rainer Schaller

IPC: G01R33/00 ,  G01R33/09

CPC classification number: G01R33/0047 ,  G01R33/091 ,  H01L43/02 ,  H01L43/08 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/48247 ,  H01L2224/4903

Abstract: An interconnect module includes a metal clip having a first end section, a second end section and a middle section extending between the first and the second end sections. The first end section is configured for external attachment to a bare semiconductor die or packaged semiconductor die attached to a carrier or to a metal region of the carrier. The second end section is configured for external attachment to a different metal region of the carrier or to a different semiconductor die or packaged semiconductor die attached to the carrier. The module further includes a magnetic field sensor secured to the metal clip. The magnetic field sensor is operable to sense a magnetic field produced by current flowing through the metal clip. The interconnect module can be used to form a direct electrical connection between components and/or metal regions of a carrier to which the module is attached.

Abstract translation: 互连模块包括具有第一端部分，第二端部部分和在第一和第二端部部分之间延伸的中间部分的金属夹。 第一端部部分被配置为外部连接到附接到载体或载体的金属区域的裸半导体管芯或封装的半导体管芯。 第二端部构造成用于外部附接到载体的不同金属区域或者附接到载体的不同的半导体管芯或封装的半导体管芯。 该模块还包括固定到金属夹的磁场传感器。 磁场传感器可操作以感测由流过金属夹的电流产生的磁场。 互连模块可以用于在模块附接到的载体的部件和/或金属区域之间形成直接电连接。

公开(公告)号：US09728493B2

公开(公告)日：2017-08-08

申请号：US14839013

申请日：2015-08-28

Applicant: Infineon Technologies AG

Inventor： Volker Strutz ,  Rainer Schaller

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49582 ,  H01L23/49586 ,  H01L2224/32245 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A semiconductor device package includes a leadframe and a semiconductor chip mounted to the leadframe. The semiconductor device package further includes a molded encapsulant configured to cast-in-place the leadframe. A surface area of the leadframe remains exposed by the encapsulant. An electrically insulating covering layer extends over a part of the surface area and is configured to divide the surface area in at least two zones.