公开(公告)号：US12289926B2

公开(公告)日：2025-04-29

申请号：US17410410

申请日：2021-08-24

Applicant: InnoLux Corporation

Inventor： Yu-Tsung Liu ,  Wei-Ju Liao ,  Po-Hsin Lin ,  Chao-Yin Lin ,  Te-Yu Lee

IPC: H10F39/00

Abstract: An electronic device is provided. The electronic device includes an optical sensing module that includes an optical sensor array. The optical sensor array includes at least one optical sensor, at least one transparent layer disposed on the optical sensor array, and a microlens array. The microlens array includes at least one microlens and is disposed on the transparent layer.

公开(公告)号：US11953372B2

公开(公告)日：2024-04-09

申请号：US17577388

申请日：2022-01-18

Applicant: InnoLux Corporation

Inventor： Yu-Tsung Liu ,  Wei-Ju Liao ,  Wei-Lin Wan ,  Cheng-Hsueh Hsieh ,  Po-Hsin Lin ,  Te-Yu Lee

IPC: G01J1/04 ,  G01J1/44 ,  H01L27/146 ,  G06V40/13

CPC classification number: G01J1/44 ,  G01J1/0411 ,  G01J1/0437 ,  H01L27/14623 ,  H01L27/14627 ,  G01J2001/446 ,  G01J2001/4473 ,  G06V40/1318

Abstract: An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.

公开(公告)号：US12019254B2

公开(公告)日：2024-06-25

申请号：US18147078

申请日：2022-12-28

Applicant: InnoLux Corporation

Inventor： Te-Yu Lee ,  Yu-Tsung Liu ,  Wei-Ju Liao ,  Po-Hsin Lin ,  Chao-Yin Lin

IPC: G06V40/13 ,  G02B5/00

CPC classification number: G02B5/005 ,  G06V40/1318

Abstract: An electronic device is provided. The electronic device includes a substrate, an optical sensing element, a light-shielding structure, and a microlens. The substrate has a normal direction. The optical sensing element is disposed on the substrate. The light-shielding structure is disposed on the optical sensing element and includes a plurality of light-shielding layers. Each light-shielding layer includes an opening, and centers of the openings are arranged along a first direction and separated from each other. The microlens is disposed on the light-shielding layers and overlaps the opening of the uppermost light-shielding layer. The microlens guides light into an optical channel formed by the openings, so that the optical sensing element has a maximum response value for light with an incident angle that is greater than or equal to 10 degrees and less than or equal to 30 degrees relative to the normal direction.