公开(公告)号：US11953372B2

公开(公告)日：2024-04-09

申请号：US17577388

申请日：2022-01-18

Applicant: InnoLux Corporation

Inventor： Yu-Tsung Liu ,  Wei-Ju Liao ,  Wei-Lin Wan ,  Cheng-Hsueh Hsieh ,  Po-Hsin Lin ,  Te-Yu Lee

IPC: G01J1/04 ,  G01J1/44 ,  H01L27/146 ,  G06V40/13

CPC classification number: G01J1/44 ,  G01J1/0411 ,  G01J1/0437 ,  H01L27/14623 ,  H01L27/14627 ,  G01J2001/446 ,  G01J2001/4473 ,  G06V40/1318

Abstract: An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.

公开(公告)号：US11854298B2

公开(公告)日：2023-12-26

申请号：US18166097

申请日：2023-02-08

Applicant: InnoLux Corporation

Inventor： Wei-Lin Wan ,  Yu-Tsung Liu ,  Te-Yu Lee

IPC: G06V40/13 ,  G06V40/40 ,  G02B5/20 ,  G06F3/041 ,  G06F3/042 ,  H01L25/16 ,  H01L33/46

CPC classification number: G06V40/1318 ,  G02B5/204 ,  G06F3/0412 ,  G06F3/0421 ,  G06V40/45 ,  H01L25/167 ,  H01L33/46

Abstract: A sensing device includes a substrate, a first circuit, a second circuit, a first photodetector, and a second photodetector. The first circuit is disposed on the substrate, and configured to sense a fingerprint. The second circuit is disposed on the substrate, and configured to detect a data of a living body. The first photodetector is electrically connected to the first circuit. The second photodetector is electrically connected to the second circuit. The area of the second photodetector is larger than the area of the first photodetector.

公开(公告)号：US11677035B2

公开(公告)日：2023-06-13

申请号：US17545184

申请日：2021-12-08

Applicant: InnoLux Corporation

Inventor： Wei-Lin Wan ,  Yu-Tsung Liu ,  Ming-Chih Chen ,  Te-Yu Lee

IPC: H01L31/0216 ,  H01L31/18

CPC classification number: H01L31/02164 ,  H01L31/1868

Abstract: A method for manufacturing a sensing device is provided. The method includes: providing a substrate; forming a sensing unit on the substrate; forming a first light-shielding layer on the sensing unit; forming a first anti-reflection layer on the sensing unit; and patterning the first light-shielding layer and the first anti-reflection layer using a single lithography process to form a first pinhole corresponding to the sensing unit.

公开(公告)号：US11605241B2

公开(公告)日：2023-03-14

申请号：US17811907

申请日：2022-07-12

Applicant: InnoLux Corporation

Inventor： Wei-Lin Wan ,  Yu-Tsung Liu ,  Te-Yu Lee

IPC: G06V40/13 ,  G06V40/40 ,  G02B5/20 ,  G06F3/041 ,  H01L33/46 ,  G06F3/042 ,  H01L25/16

Abstract: A sensing device includes a substrate, a first circuit, a second circuit, a first photodetector, and a second photodetector. The substrate has a sensing region. The first circuit is disposed on the substrate and in the sensing region, and configured to sense a fingerprint. The second circuit is disposed on the substrate and in the sensing region, and configured to sense a living body. The first photodetector is electrically connected to the first circuit. The second photodetector is electrically connected to the second circuit. The area of the second photodetector is larger than the area of the first photodetector.