公开(公告)号：US11651727B2

公开(公告)日：2023-05-16

申请号：US17543218

申请日：2021-12-06

Applicant: InnoLux Corporation

Inventor： Yi-Hua Hsu ,  Ker-Yih Kao ,  Ming-Chun Tseng ,  Mu-Fan Chang ,  Wen-Lin Huang

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G2300/026 ,  G09G2300/0408 ,  G09G2300/0426

Abstract: A light emitting device of the present disclosure includes: a circuit board; a plurality of substrates including a first substrate and a second substrate, wherein the first substrate is disposed on the circuit board, and the second substrate is disposed on the circuit board and overlapped with the first substrate; a plurality of light emitting units disposed on the first substrate; a plurality of pixel driving circuits electrically connected to the plurality of light emitting units; and a plurality of gate driving circuits electrically connected to the plurality of pixel driving circuits, wherein at least a part of the plurality of pixel driving circuits or at least a part of the plurality of gate driving circuits are disposed on the second substrate.

公开(公告)号：US12039919B2

公开(公告)日：2024-07-16

申请号：US18131135

申请日：2023-04-05

Applicant: InnoLux Corporation

Inventor： Yi-Hua Hsu ,  Ker-Yih Kao ,  Ming-Chun Tseng ,  Mu-Fan Chang ,  Wen-Lin Huang

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G2300/026 ,  G09G2300/0408 ,  G09G2300/0426

Abstract: An electronic device includes: a circuit board; a plurality of diodes disposed on a first surface of the circuit board; a plurality of first driving circuits disposed on the first surface of the circuit board and electrically connected to the plurality of diodes; and a plurality of second driving circuits electrically connected to the plurality of first driving circuits, wherein a part of the plurality of second driving circuits are disposed on a first substrate, and another part of the second driving circuits are disposed on a second substrate.

公开(公告)号：US20240147606A1

公开(公告)日：2024-05-02

申请号：US18467720

申请日：2023-09-14

Applicant: Innolux Corporation

Inventor： Mu-Fan Chang ,  Yi-Hua Hsu ,  Hung-Sheng Liao ,  Min-Hsin Lo ,  Ming-Chun Tseng ,  Ker-Yih Kao

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/60

CPC classification number: H05K1/0259 ,  H01L23/60 ,  H01L24/05 ,  H01L2224/05552 ,  H01L2924/30205 ,  H05K2201/10128

Abstract: An electronic device includes a first substrate structure, multiple electronic elements and a second substrate structure. The first substrate structure includes a first substrate. The electronic elements are disposed on the first substrate. The second substrate structure is coupled to the first substrate structure. The second substrate structure includes a second substrate, a protection circuit, a driving circuit and a bonding pad. The protection circuit is disposed on the second substrate. The driving circuit is disposed on the second substrate and configured to drive at least a part of the electronic elements. The bonding pad is disposed on the second substrate. The protection circuit is respectively coupled to the bonding pad and the driving circuit. The electronic device may reduce the damage caused by electrostatic discharge or reduce the impact of the bonding process of the bonding pad on signal conduction.