公开(公告)号：US09397151B1

公开(公告)日：2016-07-19

申请号：US14136040

申请日：2013-12-20

Applicant: Integrated Device Technology, Inc.

Inventor： Kenneth L. Astrof ,  Robert A. Gubser ,  Ajay Kumar Ghai ,  Viresh Piyush Patel ,  Jitesh Shah

IPC: H01L49/02

CPC classification number: H01L28/10 ,  H01F27/00 ,  H01L21/50 ,  H01L23/10 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/50 ,  H01L23/552 ,  H01L23/645 ,  H01L2224/16225

Abstract: A packaged integrated circuit includes an integrated circuit substrate and a cap bonded to a surface of the integrated circuit substrate. The cap has a recess therein that is at least partially lined with at least one segment of an inductor. This inductor may be electrically coupled to an electrical component within the integrated circuit substrate. In some embodiments, the inductor is patterned to extend along a sidewall and interior top surface of the recess, which extends opposite the integrated circuit substrate. The inductor may include a plurality of arcuate-shaped segments and may be patterned to be symmetric about a center-tapped portion thereof. The cap may also include a magnetic material therein that increases an effective inductance of the inductor relative to an otherwise equivalent cap and inductor combination that is devoid of the magnetic material.

Abstract translation: 封装的集成电路包括集成电路基板和结合到集成电路基板的表面的盖。 盖子在其中具有至少部分地衬有电感器的至少一个部分的凹部。 该电感器可以电耦合到集成电路基板内的电气部件。 在一些实施例中，电感器被图案化以沿着与集成电路基板相对延伸的凹部的侧壁和内部顶表面延伸。 电感器可以包括多个弧形段，并且可以被图案化成关于其中心抽头部分对称。 盖子还可以包括其中的磁性材料，其相对于没有磁性材料的否则相当的盖和电感器组合增加了电感器的有效电感。