公开(公告)号：US20250112161A1

公开(公告)日：2025-04-03

申请号：US18478538

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Minglu Liu ,  Seyyed Yahya Mousavi ,  Yingying Zhang ,  Gang Duan ,  Andrey Gunawan ,  Yosuke Kanaoka ,  Yiqun Bai ,  Ziyin Lin ,  Bohan Shan ,  Dingying Xu ,  Srinivas Pietambaram ,  Hong Seung Yeon

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/31

Abstract: Methods and apparatus to connect interconnect bridges to package substrates are disclosed. An example package substrate includes a dielectric layer including a cavity, a first contact pad positioned in the cavity, a first semiconductor die including a second contact pad and a third contact pad, the second contact pad positioned on a first surface of the first semiconductor die, the third contact pad positioned on a second surface of the first semiconductor die, the second surface opposite the first surface, the second contact pad coupled to the first contact pad, the third contact pad to be coupled to a second semiconductor die, and a non-conductive material surrounding the first contact pad and the second contact pad.