公开(公告)号：US20220416503A1

公开(公告)日：2022-12-29

申请号：US17357938

申请日：2021-06-24

Applicant: Intel Corporation

Inventor： Priyanka DOBRIYAL ,  Aditi MALLIK ,  Saeed FATHOLOLOUMI ,  Ankur AGRAWAL ,  Anna PRAKASH ,  Hemant Mahesh SHAH ,  Raiyomand ASPANDIAR ,  Neil Raymund CARANTO

IPC: H01S5/024 ,  H01S5/34

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to thermal routing techniques within a hybrid silicon laser or photonics integrated circuit to facilitate heat extraction during laser operation. In particular dual metal layers, with a top metal layer thermally coupled with P node above a quantum well and extending substantially under a heat sink, and a bottom metal layer thermally coupled with an N node, where the top metal layer and the bottom metal layer are not electrically coupled. Other embodiments may be described and/or claimed.