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公开(公告)号：US20250008697A1
公开(公告)日：2025-01-02
申请号：US18343970
申请日：2023-06-29
Applicant: Intel Corporation
Inventor： Juha Tapani Paavola , Shawn S. McEuen , Kari Mansukoski , Sami Markus Heinisuo , Cody Hougnon
IPC: H05K7/20
Abstract: Die contact torsional springs are disclosed. A disclosed lid assembly for use with a circuit board includes a lid; a lug, a crank rotatably coupled to the lug, the crank including a spine, a jog to apply force to the lid, and a lever arm extending from the spine to apply a rotational moment to the spine when pressed against a surface.
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