公开(公告)号：US12193149B2

公开(公告)日：2025-01-07

申请号：US17132329

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Sami Markus Heinisuo ,  Evan Piotr Kuklinski ,  Kari Pekka Johannes Mansukoski ,  Shawn McEuen

IPC: H05K1/02 ,  H01L23/60

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate that includes traces, a radiation source on the substrate, and a trace routable radiation shield on the substrate. At least a portion of the traces extend through the trace routable radiation shield and the trace routable radiation shield can help shield radiation sensitive components from at least a portion of the radiation from the radiation source.

公开(公告)号：US20210153339A1

公开(公告)日：2021-05-20

申请号：US17132329

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Sami Markus Heinisuo ,  Evan Piotr Kuklinski ,  Kari Pekka Johannes Mansukoski ,  Shawn McEuen

IPC: H05K1/02 ,  H01L23/60

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate that includes traces, a radiation source on the substrate, and a trace routable radiation shield on the substrate. At least a portion of the traces extend through the trace routable radiation shield and the trace routable radiation shield can help shield radiation sensitive components from at least a portion of the radiation from the radiation source.

公开(公告)号：US20250008697A1

公开(公告)日：2025-01-02

申请号：US18343970

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Juha Tapani Paavola ,  Shawn S. McEuen ,  Kari Mansukoski ,  Sami Markus Heinisuo ,  Cody Hougnon

IPC: H05K7/20

Abstract: Die contact torsional springs are disclosed. A disclosed lid assembly for use with a circuit board includes a lid; a lug, a crank rotatably coupled to the lug, the crank including a spine, a jog to apply force to the lid, and a lever arm extending from the spine to apply a rotational moment to the spine when pressed against a surface.

公开(公告)号：US20240389289A1

公开(公告)日：2024-11-21

申请号：US18319156

申请日：2023-05-17

Applicant: Intel Corporation

Inventor： Kari Mansukoski ,  Cody Kim Hougnon ,  Juha Paavola ,  Sami Markus Heinisuo ,  Sanna Mari Peurala

IPC: H05K9/00 ,  G06F1/16 ,  H05K1/02

Abstract: For example, an apparatus may include an Electromagnetic Interference (EMI) shield, which may be configured to provide EMI shielding for electronic circuitry on a Printed Circuit Board (PCB). For example, the EMI shield may be configured to include an EMI shield lid; and an EMI shield connector to electrically couple the EMI shield lid to at least one tube on the PCB to provide a ground to the EMI shield lid via the at least one tube. For example, the EMI shield connector may be configured to maintain the EMI shield lid over the electronic circuitry on the PCB.

公开(公告)号：US20220338340A1

公开(公告)日：2022-10-20

申请号：US17856791

申请日：2022-07-01

Applicant: Intel Corporation

Inventor： Juha Tapani Paavola ,  Sami Markus Heinisuo ,  Kari Pekka Johannes Mansukoski

IPC: H05K1/02 ,  H05K9/00 ,  H05K7/20

Abstract: Particular embodiments described herein provide for an electronic device can include a support structure, a radiation source on the support structure, a radiation shield around the radiation source, and a hook and loop radiation shield securing mechanism to removably secure the radiation shield to the support structure, where the hook and loop radiation shield securing mechanism includes a hook portion with a plurality of hooks and a loop portion that includes a plurality of loops, where an angle of a retention hook for each of the plurality of hooks is less than about eighty degrees.