公开(公告)号：US10598696B2

公开(公告)日：2020-03-24

申请号：US15083082

申请日：2016-03-28

Applicant: INTEL CORPORATION

Inventor： Joseph D. Stanford ,  David Craig ,  Todd P. Albertson ,  Mohit Mamodia ,  Dingying Xu

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00

Abstract: A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.

公开(公告)号：US11622466B2

公开(公告)日：2023-04-04

申请号：US16902048

申请日：2020-06-15

Applicant: Intel Corporation

Inventor： Karumbu Meyyappan ,  Kyle Arrington ,  David Craig ,  Pooya Tadayon

IPC: H01L23/498 ,  H05K7/14 ,  H05K7/20 ,  H01L23/22

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate having a first surface and a second surface opposite from the first surface, and a die on the first surface of the package substrate. In an embodiment, the electronic package further comprises a socket interface on the second surface of the package substrate. In an embodiment, the socket interface comprises a first layer, wherein the first layer comprises a plurality of wells, a liquid metal within the plurality of wells, and a second layer over the plurality of wells.

公开(公告)号：US11340258B2

公开(公告)日：2022-05-24

申请号：US16817480

申请日：2020-03-12

Applicant: INTEL CORPORATION

Inventor： Joseph D. Stanford ,  David Craig ,  Todd P. Albertson ,  Mohit Mamodia ,  Dingying Xu

IPC: G01R1/067 ,  G01R1/073 ,  G01R3/00

Abstract: A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.

公开(公告)号：US20200209280A1

公开(公告)日：2020-07-02

申请号：US16817480

申请日：2020-03-12

Applicant: INTEL CORPORATION

Inventor： Joseph D. Stanford ,  David Craig ,  Todd P. Albertson ,  Mohit Mamodia ,  Dingying Xu

IPC: G01R1/073 ,  G01R1/067 ,  G01R3/00

Abstract: A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a first pin end anchored to a substrate. At least a partial length of each of the pins is coated with a hydrophobic monolayer. The conductive pins may be composite metal wires including a core metal encased by one or more peripheral metal. At a tip of the pins, opposite the first pin end anchored to the substrate, the peripheral metals are recessed from the core metal. In further embodiments, the hydrophobic monolayer is disposed on an outer surface of the peripheral metals, but is substantially absent from a surface of the core metal exposed at the tip.