公开(公告)号：US09844144B1

公开(公告)日：2017-12-12

申请号：US15231018

申请日：2016-08-08

Applicant: Intel Corporation

Inventor： Emad Al-Momani ,  Jack Mumbo ,  Srikanth Mothukuri

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01R13/2421 ,  H05K3/325 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2201/10598 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: Apparatuses, systems and methods associated with electrical fast transient tolerant input/output (I/O) communication (e.g., universal serial bus (USB)) design are disclosed herein. In embodiments, an apparatus to mount an integrated circuit (IC) package, may include a printed circuit board (PCB), a plurality of pogo pins, and a mounting mechanism. The plurality of pogo pins may be mounted to electrical contacts of the PCB, the plurality of pogo pins may be coupled to the electrical contacts at first ends of the plurality of pogo pins and may be to couple to the IC package at second ends of the plurality of pogo pins. The mounting mechanism may position the IC package on the second ends of the plurality of pogo pins. Other embodiments may be described and/or claimed.