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公开(公告)号：US20250112085A1
公开(公告)日：2025-04-03
申请号：US18375244
申请日：2023-09-29
Applicant: Intel Corporation
Inventor： Bohan Shan , Ziyin Lin , Haobo Chen , Yiqun Bai , Kyle Arrington , Jose Waimin , Ryan Carrazzone , Hongxia Feng , Dingying Xu , Srinivas Pietambaram , Minglu Liu , Seyyed Yahya Mousavi , Xinyu Li , Gang Duan , Wei Li , Bin Mu , Mohit Gupta , Jeremy Ecton , Brandon C. Marin , Xiaoying Guo , Ashay Dani
IPC: H01L21/762 , H01L21/768 , H01L23/00 , H01L23/498 , H01L23/538 , H01L25/065
Abstract: An apparatus is provided which comprises: a plurality of interconnect layers within a substrate, organic dielectric material over the plurality of interconnect layers, copper pads on a surface of a cavity within the organic dielectric material, an integrated circuit bridge device coupled with the copper pads, wherein a surface of the integrated circuit bridge device is elevated above an opening of the cavity, underfill material between the integrated circuit bridge device and the surface of the cavity, and build-up layers formed over the organic dielectric material around the integrated circuit bridge device. Other embodiments are also disclosed and claimed.
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2.发明公开公开(公告)号：US20240270929A1
公开(公告)日：2024-08-15
申请号：US18166005
申请日：2023-02-08
Applicant: Intel Corporation
Inventor： Clay Arrington , Kyle Arrington , Ziyin Lin , Jose Waimin , Dingying Xu
CPC classification number: C08K3/041 , B82Y30/00 , B82Y40/00 , C08K9/04 , C08K2003/023 , C08K2201/011
Abstract: Capillary underfill formulations that may include fillers. The fillers may include carbon nanotubes, such as surface functionalized carbon nanotubes. Methods for forming capillary underfill materials that may have improved fracture toughness, reduced crack propagation, and a reduced likelihood of delamination. The surface functionalized carbon nanotubes may include amine functionalized carbon nanotubes. Containers, such as syringes, that may have a reservoir in which a capillary underfill formulation is disposed.
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