公开(公告)号：US11291122B2

公开(公告)日：2022-03-29

申请号：US16637545

申请日：2017-09-22

Applicant: Intel Corporation

Inventor： Darko Grujicic ,  Rengarajan Shanmugam ,  Sandeep Gaan ,  Adrian Bayraktaroglu ,  Roy Dittler ,  Ke Liu ,  Suddhasattwa Nad ,  Marcel A. Wall ,  Rahul N. Manepalli ,  Ravindra V. Tanikella

IPC: C23C18/38 ,  H05K3/38 ,  C23C18/16 ,  C23C18/18 ,  H01L21/48 ,  H05K3/42 ,  H05K3/46 ,  H05K1/11 ,  H01L23/14

Abstract: Embodiments of the present disclosure describe techniques for providing an apparatus with a substrate provided with plasma treatment. In some instances, the apparatus may include a substrate with a surface that comprises a metal layer to provide signal routing in the apparatus. The metal layer may be provided in response to a plasma treatment of the surface with a functional group containing a gas (e.g., nitrogen-based gas), to provide absorption of a transition metal catalyst into the surface, and subsequent electroless plating of the surface with a metal. The transition metal catalyst is to enhance electroless plating of the surface with the metal. Other embodiments may be described and/or claimed.