公开(公告)号：US20240063134A1

公开(公告)日：2024-02-22

申请号：US18260805

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Xiaoning Ye ,  Pooya Tadayon ,  Wenzhi Wang ,  Srinivasa R. Aravamudhan ,  Nathan Somnang Tan ,  Brett Daniel Grossman

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/498

CPC classification number: H01L23/5386 ,  H01L25/0655 ,  H01L23/5383 ,  H01L23/49894 ,  H01L23/49877 ,  H01L2224/16225 ,  H01L24/16

Abstract: Disclosed herein are integrated circuit (IC) supports with microstrips, and related embodiments. For example, an IC support may include a plurality of microstrips and a plurality of conductive segments. Individual ones of the conductive segments may be at least partially over at least two microstrips, a dielectric material may be between the plurality of microstrips and the plurality of conductive segments, and an individual conductive segment may have a conductivity that is close to or less than a conductivity of a conductive line of an individual microstrip.