公开(公告)号：US20190221488A1

公开(公告)日：2019-07-18

申请号：US16329057

申请日：2016-10-01

Applicant: Intel Corporation

Inventor： Quan QI ,  Carlton E. HANNA

IPC: H01L23/13 ,  H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L21/683 ,  H01L23/498 ,  H01L25/18 ,  H01L25/16

CPC classification number: H01L23/13 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/16 ,  H01L25/18 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19102 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/183 ,  H05K3/0097 ,  H05K3/205 ,  H05K3/4682 ,  H05K3/4697 ,  H05K2201/0989 ,  H05K2201/10674 ,  H01L2924/00014

Abstract: Embodiments are generally directed to module installation on printed circuit boards with embedded trace technology. An embodiment of a printed circuit board includes one or more layers including a top layer; multiple embedded traces that are contained in an area of a surface of a first layer of the one or more layers of the printed circuit board; and a first module, the first module being installed on the plurality of printed traces in the area.