公开(公告)号：US12294368B2

公开(公告)日：2025-05-06

申请号：US17485119

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Rahul Pal ,  Dheeraj Subbareddy ,  Mahesh Kumashikar ,  Dheemanth Nagaraj ,  Rajesh Vivekanandham ,  Anshuman Thakur ,  Ankireddy Nalamalpu ,  Md Altaf Hossain ,  Atul Maheshwari

IPC: H03K19/177 ,  G06F15/78 ,  G06F30/34 ,  H03K19/17758 ,  H03K19/17796 ,  H03K19/08

Abstract: The present disclosure is directed to 3-D stacked architecture for Programmable Fabrics and Central Processing Units (CPUs). The 3-D stacked orientation enables reconfigurability of the fabric, and allows the fabric to function using coarse-grained and fine-grained acceleration for offloading CPU processing. Additionally, the programmable fabric may be able to function to interface with multiple other compute chiplet components in the 3-D stacked orientation. This enables multiple compute components to communicate without the need for offloading the data communications between the compute chiplets.