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公开(公告)号：US20240312736A1
公开(公告)日：2024-09-19
申请号：US18185460
申请日：2023-03-17
Applicant: Intel Corporation
Inventor： Abhishek Srivastav , Smit Kapila , Prakash Kurma Raju , Sumod Cherukkate , Vijith Halestoph R , Srikanth Potluri
CPC classification number: H01H13/14 , G06F3/0202 , H01H13/70 , H04R1/028 , H04R7/04 , H01H2239/048 , H04R2499/15
Abstract: Keyboards for electronic devices with keys having integrated speakers are disclosed herein. An example keyboard includes a key having a key cap and a speaker coupled to the key cap. The speaker is disposed in or at least partially covered by the key cap.
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公开(公告)号：US20250024643A1
公开(公告)日：2025-01-16
申请号：US18897895
申请日：2024-09-26
Applicant: Intel Corporation
Inventor： Jeff Ku , Smit Kapila , Shantanu Kulkarni , Min Suet Lim , Surya Pratap Mishra
IPC: H05K7/20
Abstract: A thermal ground plane (TGP), including: a vapor chamber containing an ionized fluid; a reservoir fluidly connected with the vapor chamber, configured to store excess ionized fluid; and an electromagnetic source configured to dynamically direct a variable amount of the excess ionized fluid from the reservoir to the vapor chamber based on a thermal resistance of the ionized fluid in the vapor chamber or a temperature of the TGP at a location proximate to a heat source.
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3.发明公开公开(公告)号：US20240244772A1
公开(公告)日：2024-07-18
申请号：US18619554
申请日：2024-03-28
Applicant: Intel Corporation
Inventor： Smit Kapila , Jeff Ku , Min Suet Lim , Sarma Vmk Vedhanabhatla
IPC: H05K5/02
CPC classification number: H05K5/0213
Abstract: Techniques are described to dynamically adjust the open air ratio (OAR) while ensuring compliance with regulatory requirements. An adjustable thermal vent assembly is described that dynamically adjusts the OAR for inlet/outlet vents depending on the current use case. The adjustable thermal vent assembly functions to increase the grating spacing only when a triggering condition is met that ensures that a corresponding thermal vent location is inaccessible. Such temporarily inaccessible regions may include the bottom cover of an electronic device when positioned on the surface of an object, for thermal intake vents, or the rear portion of an electronic device when the display cover exceeds a predetermined angle, for thermal exhaust vents.
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公开(公告)号：US20230035081A1
公开(公告)日：2023-02-02
申请号：US17955839
申请日：2022-09-29
Applicant: Intel Corporation
Inventor： Smit Kapila , VMK Sarma Vedhanabhatla , Vikas Kundapura Rao , David Rittenhouse
Abstract: A thermally conductive band can improve the flow of heat from a first portion of a mobile computing device (e.g., the base portion of a laptop computer) to a second portion of the mobile computing device (e.g., the lid portion of the laptop). The band is removably attachable to the mobile computing device via magnets or another attachment approach. The band comprises a thermally conductive layer, a first end removably attachable to an external surface of the first device portion, and a second end removably attachable to an external surface of the second device portion. The band can comprise thermal gap pads between the thermally conductive layer and the external surfaces to aid in providing a low thermal resistance path between the device and the band.
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公开(公告)号：US20220326096A1
公开(公告)日：2022-10-13
申请号：US17850561
申请日：2022-06-27
Applicant: Intel Corporation
Inventor： Smit Kapila , Abhishek Srivastav , Sumod Cherukkate , Manit Biswas , Zhongsheng Wang , Bijendra Singh , Deepak Ganapathy , Dipen Dudhat
Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to monitor thermal degradation of a compute device. One such method includes calculating, by executing instructions with processor circuitry, a thermal degradation value based on an equation, the equation generated based on testing of thermal interface materials having varying degrees of degradation. The method also includes comparing, by executing instructions with the processor circuitry, the thermal degradation value to a thermal degradation threshold to determine whether the thermal degradation threshold is satisfied, and, when the thermal degradation threshold is satisfied, triggering generation of a thermal degradation alert.
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Patent Agency Ranking
公开(公告)号：US12278659B2
公开(公告)日：2025-04-15
申请号：US17348803
申请日：2021-06-16
Applicant: Intel Corporation
Inventor： Smit Kapila , Jayprakash Thakur , Santosh Gangal
Abstract: A wireless computing device may include an internal antenna, a radio frequency (RF) transmission path that is switchably connectable to the internal antenna, a Universal Serial Bus (USB) connector configured to connect to an external antenna, a detector configured to detect if an external antenna is connected to the USB connector, and an antenna selector configured to (1) connect the internal antenna into the RF transmission path if the detector detects that no external antenna is connected to the USB connector and (2) disconnect the internal antenna from the RF transmission path and connect the external antenna into the RF transmission path if the detector detects that the external antenna is connected to the USB connector, thereby improving the wireless transmission/reception performance of the internal wireless module of the wireless computing device.
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公开(公告)号：US20250016930A1
公开(公告)日：2025-01-09
申请号：US18895796
申请日：2024-09-25
Applicant: Intel Corporation
Inventor： Min Suet Lim , Luis Alvarez Mata , Jia Yan Go , Smit Kapila , Chaitra Kotehal , Jeff Ku , Shantanu Kulkarni , Kari Mansukoski , Surya Pratap Mishra
IPC: H05K1/18
Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for inductors of voltage regulators that are built into and/or around mounting holes of a printed circuit board. An example apparatus includes a printed circuit board that includes a plurality of layers and a mounting hole extending through the plurality of layers, and an inductor at least partially in the mounting hole between two or more of the plurality of layers.
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公开(公告)号：US20230269867A1
公开(公告)日：2023-08-24
申请号：US17842215
申请日：2022-06-16
Applicant: Intel Corporation
Inventor： Smit Kapila , Navneet Singh , Samantha Rao , Samarth Alva
CPC classification number: H05K1/0271 , H05K1/181 , H05K2201/10015
Abstract: Capacitors are commonly used in design and manufacturing of PCBs, which may exhibit a vibration effect, such as a piezoelectric effect. This vibration may induce acoustic noise. PCB capacitor-induced acoustic noise mitigation may include receiving an AC input that is converted and applied to a voltage rail, which may be used by first capacitor set. An additional capacitor set may receive and invert the voltage rail signal and oscillate (e.g., vibrate) out of phase with the first capacitor set, such that the second capacitor set mitigates or cancels the acoustic noise generated by the first capacitor set.
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公开(公告)号：US20250113460A1
公开(公告)日：2025-04-03
申请号：US18979203
申请日：2024-12-12
Applicant: Intel Corporation
Inventor： Jeff Ku , Smit Kapila , Min Suet Lim , Surya Pratap Mishra , Kari Mansukoski , Shantanu D. Kulkarni
Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for foldable thermal ground planes for electronic devices. An example an apparatus to cool an electronic device includes a first plate; a second plate; a plurality of first pillars extending between the first plate and the second plate, the plurality of first pillars having a first shape; a plurality of second pillars extending between the first plate and the second plate, the plurality of second pillars having a second shape, the second shape different than the first shape; and a hinge separating the apparatus into a first section and a second section, the plurality of second pillars in the hinge.
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公开(公告)号：US20250039249A1
公开(公告)日：2025-01-30
申请号：US18912531
申请日：2024-10-10
Applicant: Intel Corporation
Inventor： Jithin Valappilekandy , Smit Kapila , Sangeeta Manepalli , Balvinder Pal Singh , Abhishek Srivastav
IPC: H04L65/1069 , H04W4/80
Abstract: This disclosure describes systems, methods, and devices for remotely controlling device settings for collaboration sessions. A device may identify an alphanumeric handle based on a location identifier of a first location associated with the device and a collaboration session identifier for a collaboration session of a collaboration application executed by the device; generate a Bluetooth Low Energy (BLE) advertising packet including a header and a payload, the header including the alphanumeric handle and a hardware identifier that identifies the device; transmit the BLE advertising packet; identify an authentication request received from a second device in the collaboration session, the authentication request including the alphanumeric handle; authenticate the second device based on the alphanumeric handle; and transmit a BLE notification packet including an indication of a volume at which the second device is to set a speaker for the collaboration session.
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