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公开(公告)号：US20190011962A1
公开(公告)日：2019-01-10
申请号：US15924796
申请日：2018-03-19
Applicant: Intel Corporation
Inventor： Aleksander Magi , Mark J. Gallina , Catharina Biber , Xi Guo , Gabriele C. Garbarino
CPC classification number: G06F1/20 , G06F1/1632
Abstract: The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.
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公开(公告)号：US11073876B2
公开(公告)日：2021-07-27
申请号：US16658827
申请日：2019-10-21
Applicant: Intel Corporation
Inventor： Aleksander Magi , Mark J. Gallina , Catharina Biber , Xi Guo , Gabriele C. Garbarino
Abstract: The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.
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公开(公告)号：US20170185112A1
公开(公告)日：2017-06-29
申请号：US14998063
申请日：2015-12-24
Applicant: INTEL CORPORATION
Inventor： Aleksander Magi , Mark J. Gallina , Catharina Biber , Xi Guo , Gabriele C. Garbarino
CPC classification number: G06F1/20 , G06F1/1632
Abstract: The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.
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公开(公告)号：US12146476B2
公开(公告)日：2024-11-19
申请号：US17561605
申请日：2021-12-23
Applicant: Intel Corporation
Inventor： Jeff Ku , Mark J. Gallina , Min Suet Lim , Jianfang Zhu
Abstract: Particular embodiments described herein provide for a flexible vapor chamber with shape memory material for an electronic device. In an example, the electronic device can include a flexible vapor chamber and shape memory material coupled to the shape memory material. When the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber to a position that helps with heat dissipation of heat collected by the flexible vapor chamber.
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Patent Agency Ranking
公开(公告)号：US10957656B2
公开(公告)日：2021-03-23
申请号：US16641601
申请日：2017-09-27
Applicant: Intel Corporation
Inventor： Kyle Yazzie , Naga Sivakumar Yagnamurthy , Pramod Malatkar , Chia-Pin Chiu , Mohit Mamodia , Mark J. Gallina , Rajesh Kumar Neerukatti , Joseph Bautista , Michael Gregory Drake
IPC: H01L23/40 , H01L23/00 , H01L23/367 , H01L23/498
Abstract: Disclosed herein are integrated circuit (IC) packages with an electronic component having a patterned protective material on a face, as well as related devices and methods. In some embodiments, a computing device may include: an integrated circuit (IC) package with an electronic component having a protective material on the back face of the electronic component, where the protective material is patterned to include an area on the back face of the electronic component that is not covered by the protective material; a circuit board, where the IC package is electrically coupled to the circuit board; and a heat spreader, where the heat spreader is secured to the circuit board and in thermal contact with the area on the back face of the electronic component that is not covered by the protective material.
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公开(公告)号：US20200159295A1
公开(公告)日：2020-05-21
申请号：US16658827
申请日：2019-10-21
Applicant: Intel Corporation
Inventor： Aleksander Magi , Mark J. Gallina , Catharina Biber , Xi Guo , Gabriele C. Garbarino
Abstract: The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.
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公开(公告)号：US20220186716A1
公开(公告)日：2022-06-16
申请号：US17561605
申请日：2021-12-23
Applicant: Intel Corporation
Inventor： Jeff Ku , Mark J. Gallina , Min Suet Lim , Jianfang Zhu
Abstract: Particular embodiments described herein provide for a flexible vapor chamber with shape memory material for an electronic device. In an example, the electronic device can include a flexible vapor chamber and shape memory material coupled to the shape memory material. When the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber to a position that helps with heat dissipation of heat collected by the flexible vapor chamber.
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公开(公告)号：US10452108B2
公开(公告)日：2019-10-22
申请号：US15924796
申请日：2018-03-19
Applicant: Intel Corporation
Inventor： Aleksander Magi , Mark J. Gallina , Catharina Biber , Xi Guo , Gabriele C. Garbarino
Abstract: The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.
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公开(公告)号：US09921618B2
公开(公告)日：2018-03-20
申请号：US14998063
申请日：2015-12-24
Applicant: INTEL CORPORATION
Inventor： Aleksander Magi , Mark J. Gallina , Catharina Biber , Xi Guo , Gabriele C. Garbarino
CPC classification number: G06F1/20 , G06F1/1632
Abstract: The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.
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