公开(公告)号：US11548780B2

公开(公告)日：2023-01-10

申请号：US17516245

申请日：2021-11-01

Applicant: INVENSENSE, INC.

Inventor： David deKoninck ,  Varun Subramaniam Kumar ,  Matthew Julian Thompson ,  Vadim Tsinker ,  Logeeswaran Veerayah Jayaraman ,  Sarah Nitzan ,  Houri Johari-Galle ,  Jongwoo Shin ,  Le Jin

IPC: G01L19/04 ,  G01K1/20 ,  B81B7/00 ,  G01L9/00

Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

公开(公告)号：US11186479B2

公开(公告)日：2021-11-30

申请号：US16547257

申请日：2019-08-21

Applicant: INVENSENSE, INC.

Inventor： David deKoninck ,  Varun Subramaniam Kumar ,  Matthew Julian Thompson ,  Vadim Tsinker ,  Logeeswaran Veerayah Jayaraman ,  Sarah Nitzan ,  Houri Johari-Galle ,  Jongwoo Shin ,  Le Jin

IPC: G01L19/04 ,  G01K1/20 ,  B81B7/00 ,  G01L9/00

Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

公开(公告)号：US20230365397A1

公开(公告)日：2023-11-16

申请号：US17740832

申请日：2022-05-10

Applicant: InvenSense, Inc.

Inventor： Mrigank Sharma ,  Varun Subramaniam Kumar ,  Luca Coronato ,  Giacomo Laghi ,  Matthew Julian Thompson

IPC: B81B3/00

CPC classification number: B81B3/0054 ,  B81B2201/0235 ,  B81B2203/0307

Abstract: A MEMS sensor includes at least one anchor that extends into a MEMS layer and a proof mass suspended from the at least one anchor. Each anchor is coupled to the proof mass via two compliant springs that are oriented perpendicular to each other and attached to a respective anchor. The compliant springs absorb non-measured external forces such as shear forces that are applied to the sensor packaging, preventing these forces from modifying the relative location and operation of the proof mass.

公开(公告)号：US20210053819A1

公开(公告)日：2021-02-25

申请号：US16547257

申请日：2019-08-21

Applicant: INVENSENSE, INC.

Inventor： David deKoninck ,  Varun Subramaniam Kumar ,  Matthew Julian Thompson ,  Vadim Tsinker ,  Logeeswaran Veerayah Jayaraman ,  Sarah Nitzan ,  Houri Johari-Galle ,  Jongwoo Shin ,  Le Jin

IPC: B81B7/00 ,  G01L9/00 ,  G01K1/20 ,  G01L19/04

Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

公开(公告)号：US20250164520A1

公开(公告)日：2025-05-22

申请号：US18896555

申请日：2024-09-25

Applicant: InvenSense, Inc.

Inventor： Xian HUANG ,  Varun Subramaniam Kumar ,  Eric Lautenschlager ,  Matthew Julian Thompson ,  Mrigank Sharma ,  Wenting Gu

IPC: G01P15/08

Abstract: A microelectromechanical system (MEMS) accelerometer includes a proof mass that translates outside of a MEMS device plane in response to a force of interest such as a z-axis linear acceleration. The proof mass is a component of a suspended spring-mass system that is anchored to both a cover substrate layer and a base substrate layer by an anchoring system. The anchoring system includes a central anchor that is mechanically anchored to only the cover layer, while two adjacent anchors are located at opposite sides of the central anchor and are anchored to at least the base substrate and have an electrical connection to processing circuitry of the base substrate. Compliant springs connect the central anchor to the two adjacent anchors in a manner such that the anchoring system absorbs applied stresses such as shear forces applied during system packaging, assembly, and during use in an end product.

公开(公告)号：US11761977B1

公开(公告)日：2023-09-19

申请号：US17733495

申请日：2022-04-29

Applicant: InvenSense, Inc.

Inventor： Varun Subramaniam Kumar ,  Mrigank Sharma ,  Giacomo Laghi ,  Luca Coronato ,  Matthew Julian Thompson

IPC: G01P15/125 ,  G01P15/08

CPC classification number: G01P15/125 ,  G01P2015/0862

Abstract: A MEMS sensor includes a central anchoring region that maintains the relative position of an attached proof mass relative to sense electrodes in the presence of undesired forces and stresses. The central anchoring region includes one or more first anchors that rigidly couple to a cover substrate and a base substrate. One or more second anchors are rigidly coupled to only the cover substrate and are connected to the one or more first anchors within the MEMS layer via an isolation spring. The proof mass in turn is connected to the one or more second anchors via one or more compliant springs.

公开(公告)号：US11738994B2

公开(公告)日：2023-08-29

申请号：US18080169

申请日：2022-12-13

Applicant: InvenSense, Inc.

Inventor： David deKoninck ,  Varun Subramaniam Kumar ,  Matthew Julian Thompson ,  Vadim Tsinker ,  Logeeswaran Veerayah Jayaraman ,  Sarah Nitzan ,  Houri Johari-Galle ,  Jongwoo Shin ,  Le Jin

IPC: G01L19/04 ,  G01K1/20 ,  B81B7/00 ,  G01L9/00

CPC classification number: B81B7/0019 ,  B81B7/0087 ,  G01K1/20 ,  G01L9/0072 ,  G01L19/04 ,  B81B2201/0242

Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

公开(公告)号：US11073531B2

公开(公告)日：2021-07-27

申请号：US16547268

申请日：2019-08-21

Applicant: INVENSENSE, INC.

Inventor： David deKoninck ,  Varun Subramaniam Kumar ,  Matthew Julian Thompson ,  Vadim Tsinker ,  Logeeswaran Veerayah Jayaraman ,  Sarah Nitzan ,  Houri Johari-Galle ,  Jongwoo Shin ,  Le Jin

IPC: G01P1/00 ,  G01P15/125

Abstract: A microelectromechanical (MEMS) accelerometer has a proof mass and a fixed electrode. The fixed electrode is located relative to the proof mass such that a capacitance formed by the fixed electrode and the proof mass changes in response to a linear acceleration along a sense axis of the accelerometer. The MEMS accelerometer is exposed to heat sources that produce a z-axis thermal gradient in MEMS accelerometer and an in-plane thermal gradient in the X-Y plane of the MEMS accelerometer. The z-axis thermal gradient is sensed with a plurality of thermistors located relative to anchoring regions of a CMOS layer of the MEMS accelerometer. The configuration of the thermistors within the CMOS layer measures the z-axis thermal gradient while rejecting other lateral thermal gradients. Compensation is performed at the accelerometer based on the z-axis thermal gradient.

公开(公告)号：US20210055321A1

公开(公告)日：2021-02-25

申请号：US16547268

申请日：2019-08-21

Applicant: INVENSENSE, INC.

Inventor： David deKoninck ,  Varun Subramaniam Kumar ,  Matthew Julian Thompson ,  Vadim Tsinker ,  Logeeswaran Veerayah Jayaraman ,  Sarah Nitzan ,  Houri Johari-Galle ,  Jongwoo Shin ,  Le Jin

IPC: G01P1/00 ,  G01P15/125

Abstract: A microelectromechanical (MEMS) accelerometer has a proof mass and a fixed electrode. The fixed electrode is located relative to the proof mass such that a capacitance formed by the fixed electrode and the proof mass changes in response to a linear acceleration along a sense axis of the accelerometer. The MEMS accelerometer is exposed to heat sources that produce a z-axis thermal gradient in MEMS accelerometer and an in-plane thermal gradient in the X-Y plane of the MEMS accelerometer. The z-axis thermal gradient is sensed with a plurality of thermistors located relative to anchoring regions of a CMOS layer of the MEMS accelerometer. The configuration of the thermistors within the CMOS layer measures the z-axis thermal gradient while rejecting other lateral thermal gradients. Compensation is performed at the accelerometer based on the z-axis thermal gradient.