公开(公告)号：US20190169018A1

公开(公告)日：2019-06-06

申请号：US15985283

申请日：2018-05-21

Applicant: InvenSense, Inc.

Inventor： Doruk SENKAL ,  Yang LIN ,  Houri JOHARI-GALLE ,  Joseph SEEGER

IPC: B81B7/00

Abstract: A device for reducing package stress sensitivity of a sensor includes one or more anchor points for attaching to a substrate; a rigid frame structure configured to at least partially support the sensor; and a compliant element between each anchor point and the rigid frame structure. Also disclosed is a device for supporting a micro-electro-mechanical (MEMS) sensor comprising four anchor points for attaching to a substrate; a rigid frame structure configured to support the MEMS sensor; and a crab-leg suspension element between each anchor point and the rigid frame structure, wherein the crab-leg suspension element is compliant. A method for reducing package stress sensitivity of a sensor is provided as well.