公开(公告)号：US20190169018A1

公开(公告)日：2019-06-06

申请号：US15985283

申请日：2018-05-21

Applicant: InvenSense, Inc.

Inventor： Doruk SENKAL ,  Yang LIN ,  Houri JOHARI-GALLE ,  Joseph SEEGER

IPC: B81B7/00

Abstract: A device for reducing package stress sensitivity of a sensor includes one or more anchor points for attaching to a substrate; a rigid frame structure configured to at least partially support the sensor; and a compliant element between each anchor point and the rigid frame structure. Also disclosed is a device for supporting a micro-electro-mechanical (MEMS) sensor comprising four anchor points for attaching to a substrate; a rigid frame structure configured to support the MEMS sensor; and a crab-leg suspension element between each anchor point and the rigid frame structure, wherein the crab-leg suspension element is compliant. A method for reducing package stress sensitivity of a sensor is provided as well.

公开(公告)号：US20160376143A1

公开(公告)日：2016-12-29

申请号：US14935296

申请日：2015-11-06

Applicant: InvenSense, Inc.

Inventor： Jongwoo SHIN ,  Houri JOHARI-GALLE ,  Martin LIM ,  Joseph SEEGER

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0089 ,  B81B7/0038 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/00206 ,  B81C2201/016 ,  B81C2203/035

Abstract: A MEMS device and method for providing a MEMS device are disclosed. In a first aspect, the MEMS device comprises a first substrate and a second substrate coupled to the first substrate forming a sealed enclosure. A moveable structure is located within the sealed enclosure. An outgassing layer is formed on the first or second substrates and within the sealed enclosure. A first conductive layer is disposed between the moveable structure and the outgassing layer, wherein the first conductive layer allows outgassing species to pass therethrough.

Abstract translation: 公开了一种用于提供MEMS器件的MEMS器件和方法。 在第一方面，MEMS装置包括第一基板和耦合到第一基板的第二基板，形成密封外壳。 可移动的结构位于密封的外壳内。 在第一或第二基板上和密封的外壳内形成除气层。 第一导电层设置在可移动结构和除气层之间，其中第一导电层允许除气物质通过其中。

公开(公告)号：US20190035905A1

公开(公告)日：2019-01-31

申请号：US16044233

申请日：2018-07-24

Applicant: InvenSense, Inc.

Inventor： Bongsang KIM ,  Jongwoo SHIN ,  Joseph SEEGER ,  Logeeswaran Veerayah JAYARAMAN ,  Houri JOHARI-GALLE

IPC: H01L29/49 ,  G01P15/097 ,  H01L23/532

Abstract: A method includes depositing a silicon layer over a first oxide layer that overlays a first silicon substrate. The method further includes depositing a second oxide layer over the silicon layer to form a composite substrate. The composite substrate is bonded to a second silicon substrate to form a micro-electro-mechanical system (MEMS) substrate. Holes within the second silicon substrate are formed by reaching the second oxide layer of the composite substrate. The method further includes removing a portion of the second oxide layer through the holes to release MEMS features. The MEMS substrate may be bonded to a CMOS substrate.