公开(公告)号：US20240057256A1

公开(公告)日：2024-02-15

申请号：US18268867

申请日：2021-05-19

Applicant: JCET GROUP CO., LTD.

Inventor： Yaojian LIN ,  Chenye HE ,  Shuo LIU ,  Danfeng YANG ,  Li ZOU

IPC: H05K1/16 ,  H05K1/14 ,  H05K1/11 ,  H05K3/34 ,  H05K3/28 ,  H05K3/10

CPC classification number: H05K1/165 ,  H05K1/144 ,  H05K1/111 ,  H05K3/3457 ,  H05K3/284 ,  H05K3/103 ,  H05K2203/041 ,  H05K2201/0715 ,  H05K2201/0909

Abstract: The present invention provides a package structure with an inductor and a manufacturing method thereof, the inductor and the interconnection component are used as n second package module, and stacked with other components such as the first package module to form a stack-like package structure. The first package module is provided with other electronic elements. Then the first and second package modules can be synchronously subjected to package manufacturing, which improves the production efficiency. Additionally, the soldering balls with different heights are formed on the first faces of the interconnecting structural component and the inductive device by adjusting the consumption of soldering paste, which make the second faces of the inductor and the interconnection component are coplanar, then inductor with different heights can form a flat interconnecting plane, which makes the sequential process such as pasting and mounting can be conveniently performed. The process is simplified, and the reliability of the package structure is improved.