公开(公告)号：US20240057256A1

公开(公告)日：2024-02-15

申请号：US18268867

申请日：2021-05-19

Applicant: JCET GROUP CO., LTD.

Inventor： Yaojian LIN ,  Chenye HE ,  Shuo LIU ,  Danfeng YANG ,  Li ZOU

IPC: H05K1/16 ,  H05K1/14 ,  H05K1/11 ,  H05K3/34 ,  H05K3/28 ,  H05K3/10

CPC classification number: H05K1/165 ,  H05K1/144 ,  H05K1/111 ,  H05K3/3457 ,  H05K3/284 ,  H05K3/103 ,  H05K2203/041 ,  H05K2201/0715 ,  H05K2201/0909

Abstract: The present invention provides a package structure with an inductor and a manufacturing method thereof, the inductor and the interconnection component are used as n second package module, and stacked with other components such as the first package module to form a stack-like package structure. The first package module is provided with other electronic elements. Then the first and second package modules can be synchronously subjected to package manufacturing, which improves the production efficiency. Additionally, the soldering balls with different heights are formed on the first faces of the interconnecting structural component and the inductive device by adjusting the consumption of soldering paste, which make the second faces of the inductor and the interconnection component are coplanar, then inductor with different heights can form a flat interconnecting plane, which makes the sequential process such as pasting and mounting can be conveniently performed. The process is simplified, and the reliability of the package structure is improved.

公开(公告)号：US20240413042A1

公开(公告)日：2024-12-12

申请号：US18736444

申请日：2024-06-06

Applicant: JCET Group Co., Ltd.

Inventor： Shuo LIU ,  Chen XU ,  JianYong WU

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/528

Abstract: A package structure and a method for forming the same are provided. The package structure includes: a first substrate having an upper surface and a lower surface that are opposite to each other, wherein at least one trench is defined in the first substrate, the trench extending through a portion of the upper surface of the first substrate; a first chip mounted onto the upper surface of the first substrate on a side of the trench, wherein the first chip electrically connects to the first substrate; a heat sink lid including a horizontal heat sink plate and a first vertical pin and at least one second vertical pin, wherein a length of the second vertical pin is greater than a length of the first vertical pin, and the heat sink lid is mounted onto the upper surface of the first substrate.

公开(公告)号：US20240312861A1

公开(公告)日：2024-09-19

申请号：US18607298

申请日：2024-03-15

Applicant: JCET Group Co. Ltd.

Inventor： Chen XU ,  JianYong WU ,  Shuo LIU

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L23/367 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/92225

Abstract: Disclosed are a three-dimensional package structure and a method for forming the same. The method includes: flip-mounting the first die onto the first substrate; mounting the heat conductive plate onto the first substrate, such that bottom portions of the two vertical plates of the heat conductive plate are attached onto a surface of the first substrate and the lateral plate is attached onto a surface, away from the first substrate, of the first die; mounting the second substrate over the first substrate, such that top portions of the two vertical plates of the heat conductive plate are respectively embedded into the two openings; filling up a space between the first substrate and the second substrate with a molding layer; flip-mounting the second die onto a surface of the second substrate; and mounting the heat sink, such that the heat sink encircles an outer surface of the second die.