公开(公告)号：US20240105538A1

公开(公告)日：2024-03-28

申请号：US18469536

申请日：2023-09-18

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： SangHo SONG ,  HyunSu TAK ,  DongChul SHIN

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/67 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/18

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67282 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L25/18 ,  H01L2224/13024 ,  H01L2224/16235 ,  H01L2224/48235

Abstract: An electronic package and a method for making an electronic package are provided. The electronic package comprises a substrate; a plurality of electronic components disposed on the substrate; and an encapsulant cap for encapsulating the substrate and the plurality of electronic components, wherein the encapsulant cap comprises a top surface having a first region and a second region; and wherein the first region has a first roughness, the second region has a second roughness greater than the first roughness.

公开(公告)号：US20240421015A1

公开(公告)日：2024-12-19

申请号：US18746135

申请日：2024-06-18

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： SeungHyun LEE ,  YeJin PARK ,  HeeSoo LEE ,  HyunSu TAK ,  SangJun PARK

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/14 ,  H01L23/552 ,  H01L25/16 ,  H01R12/52

Abstract: A semiconductor package is disclosed. The semiconductor package comprises: a metal shim, a package substrate attached onto a front side of the metal shim, wherein the package substrate comprises an opening that passes therethrough; one or more electronic components mounted on the package substrate; an encapsulant layer partially formed on the package substrate to expose a region of the package substrate and the opening of the package substrate, wherein the encapsulant layer encapsulates the one or more electronic components on the package substrate; a first connector mounted in the exposed region of the package substrate; a second connector mounted in the encapsulant layer and on the package substrate; and a magnet mounted in the opening of the package substrate and extending from the metal shim through the package substrate and the encapsulant layer.