公开(公告)号：US20250105194A1

公开(公告)日：2025-03-27

申请号：US18896961

申请日：2024-09-26

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： SeungHyun LEE ,  SangHoon LEE ,  DoYeon PARK ,  SangJun PARK ,  JaeKyung JEON

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L25/18

Abstract: A method for forming conductive blocks on a package substrate, a semiconductor package and a method for forming the same is provided. The method for forming conductive blocks on a package substrate comprises: providing a package substrate with multiple sets of conductive pads formed thereon; depositing a solder material onto the package substrate to form solder bumps on the multiple sets of conductive pads; attaching multiple conductive blocks onto the package substrate, wherein each of the multiple conductive bloc aligned with one of the multiple sets of conductive pads; loading the package substrate on a bottom chase with the multiple conductive blocks facing upward; and pressing, with a top chase, the conductive blocks against the bottom chase to reshape the solder bumps and horizontally align top surfaces of the multiple conductive blocks with each other.