公开(公告)号：US20240234336A1

公开(公告)日：2024-07-11

申请号：US18395650

申请日：2023-12-25

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： DoYeon PARK ,  SangJun PARK ,  JiYeon KIM

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/565 ,  H01L23/49816

Abstract: An electronic device and a method for manufacturing an electronic device are provided. The electronic device includes: a substrate; at least one electronic component mounted on the substrate; an encapsulant layer formed on the substrate and encapsulating the at least one electronic component; at least one metal bar mounted on the substrate and protruding above the encapsulant layer; and a shielding layer formed over the encapsulant layer, wherein the shielding layer is in contact with the at least one metal bar; wherein the encapsulant layer includes at least one trench each being adjacent to and extending around one of the at least one metal bar to expose an upper portion of a lateral surface of the metal bar from the encapsulant layer.

公开(公告)号：US20250105194A1

公开(公告)日：2025-03-27

申请号：US18896961

申请日：2024-09-26

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： SeungHyun LEE ,  SangHoon LEE ,  DoYeon PARK ,  SangJun PARK ,  JaeKyung JEON

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L23/552 ,  H01L25/18

Abstract: A method for forming conductive blocks on a package substrate, a semiconductor package and a method for forming the same is provided. The method for forming conductive blocks on a package substrate comprises: providing a package substrate with multiple sets of conductive pads formed thereon; depositing a solder material onto the package substrate to form solder bumps on the multiple sets of conductive pads; attaching multiple conductive blocks onto the package substrate, wherein each of the multiple conductive bloc aligned with one of the multiple sets of conductive pads; loading the package substrate on a bottom chase with the multiple conductive blocks facing upward; and pressing, with a top chase, the conductive blocks against the bottom chase to reshape the solder bumps and horizontally align top surfaces of the multiple conductive blocks with each other.