公开(公告)号：US20240234336A1

公开(公告)日：2024-07-11

申请号：US18395650

申请日：2023-12-25

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： DoYeon PARK ,  SangJun PARK ,  JiYeon KIM

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L21/565 ,  H01L23/49816

Abstract: An electronic device and a method for manufacturing an electronic device are provided. The electronic device includes: a substrate; at least one electronic component mounted on the substrate; an encapsulant layer formed on the substrate and encapsulating the at least one electronic component; at least one metal bar mounted on the substrate and protruding above the encapsulant layer; and a shielding layer formed over the encapsulant layer, wherein the shielding layer is in contact with the at least one metal bar; wherein the encapsulant layer includes at least one trench each being adjacent to and extending around one of the at least one metal bar to expose an upper portion of a lateral surface of the metal bar from the encapsulant layer.

公开(公告)号：US20250125295A1

公开(公告)日：2025-04-17

申请号：US18829324

申请日：2024-09-10

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： SeungHyun LEE ,  SangJun PARK ,  NamGu KIM ,  GyeongMin KIM ,  JiYeon KIM ,  SoYeong LEE

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/552

Abstract: A semiconductor package and a method for making the same are provided. The method includes: providing a package substrate having a first surface and a second surface opposite to the first surface; mounting a plurality of conductive blocks onto the first surface of the package substrate; forming at least one conductive bump on each of the conductive blocks; forming a first encapsulant on the first surface of the package substrate to encapsulate the conductive blocks and the conductive bump on each of the conductive blocks; and grinding the first encapsulant to remove an upper portion of the first encapsulant and an upper portion of the conductive bump on each of the conductive blocks, such that an exposed surface of the conductive bump on each of the conductive blocks is at a same height relative to the first surface of the package substrate.