公开(公告)号：US20240098907A1

公开(公告)日：2024-03-21

申请号：US18459008

申请日：2023-08-30

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： HyoDong RYU ,  SeungHyun LEE ,  WonSang RHEE ,  HunTaek LEE ,  KyoungHee PARK

IPC: H05K3/34

CPC classification number: H05K3/3485 ,  H05K3/3436

Abstract: Provided is a method for forming an electronic package, comprising: providing a substrate comprising a first set of conductive pads at which a set of terminals of a first electronic component are to be mounted, respectively; forming solder paste on each of the first set of conductive pads, wherein the solder paste exposes a portion of a surface of a conductive pad that is facing away from the others of the first set of conductive pads but does not substantially expose another portion of the surface of the conductive pad that is facing towards the others of the first set of conductive pads; placing the first electronic component on the substrate with the set of terminals of the first electronic component aligned with the first set of conductive pads; reflowing the solder paste on the first set of conductive pads to secure the first electronic component onto the substrate.

公开(公告)号：US20240071991A1

公开(公告)日：2024-02-29

申请号：US18451115

申请日：2023-08-17

Applicant: JCET STATS ChipPAC Korea Limited

Inventor： SeungHyun LEE ,  KyoungHee PARK ,  HunTaek LEE ,  KyungHwan KIM ,  WonSang RHEE

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L23/498 ,  H01L23/66

CPC classification number: H01L24/97 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/49816 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6644 ,  H01L2223/6677 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/15153 ,  H01L2924/1811

Abstract: A method for making an electronic package is provided. The method includes providing a substrate strip comprising substrate assemblies, each substrate assembly comprises a first substrate and a second substrate connected to the first substrate via a flexible link, the first substrate comprises a first mounting surface, the second substrate comprises a second mounting surface that is not at a same side of the substrate assembly as the first mounting surface; disposing the substrate strip on a first carrier; attaching a first electronic component onto the first mounting surface; disposing the substrate strip on a second carrier with a plurality of cavities, the first electronic component is received within one of the plurality of cavities; attaching a second electronic component onto the second mounting surface; singulating the substrate assemblies from each other; and bending the flexible link to form an angle between the first substrate and the second substrate.