公开(公告)号：US20130105212A1

公开(公告)日：2013-05-02

申请号：US13667080

申请日：2012-11-02

Applicant: Japan Electronic Materials Corp.

Inventor： Mitsuaki Tsuboi

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H05K1/115 ,  G01R3/00 ,  G01R31/2889 ,  H05K1/0251 ,  H05K3/4046 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/097 ,  H05K2201/09809 ,  Y10T29/49126

Abstract: A multilayer insulating substrate with excellent electrical characteristics and a method for manufacturing the multilayer insulating substrate. A multilayer insulating substrate is composed of a first insulating layer including first central conductor regions to constitute through electrodes and first outer conductor regions surrounding the first central conductor regions, and a second insulating layer including second central conductor regions to constitute through electrodes and second outer conductor regions surrounding the second central conductor regions, wherein the second insulating layer is laminated on the first insulating layer to allow electrical connection between the first central conductor regions and the second central conductor regions and electrical connection between the first outer conductor regions and the second outer conductor regions so that a coaxial wiring structure is configured by the first outer conductor regions and the second outer conductor regions relative to the first central conductor regions and the second central conductor regions.

Abstract translation: 具有优异电气特性的多层绝缘基板和制造多层绝缘基板的方法。 多层绝缘基板由包括构成贯通电极的第一中心导体区域和围绕第一中心导体区域的第一外部导体区域构成的第一绝缘层，以及包含第二中心导体区域的第二绝缘层构成通孔电极和第二外部导体 围绕所述第二中心导体区域的区域，其中所述第二绝缘层层压在所述第一绝缘层上，以允许所述第一中心导体区域和所述第二中心导体区域之间的电连接以及所述第一外导体区域与所述第二外导体之间的电连接 使得相对于第一中心导体区域和第二中心导体区域，由第一外部导体区域和第二外部导体区域构成同轴布线结构。