公开(公告)号：US20090279269A1

公开(公告)日：2009-11-12

申请号：US12419514

申请日：2009-04-07

Applicant: Jason SHIUE

Inventor： Jason SHIUE

IPC: H05K5/00 ,  H05K3/28 ,  B05D5/00

CPC classification number: H05K3/284 ,  H05K2201/09872 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: A waterproof method for an electronic device and a waterproof electronic device are provided. The electronic device comprises a printed circuit board, which comprises a board, a plurality of electrical elements and a button device. The waterproof method comprises the following steps: applying a first non-solid adhesive to cover the button device directly, curing the first non-solid adhesive to form a first waterproof layer, applying a second non-solid adhesive to at least cover the electrical elements directly and curing the second non-solid adhesive to form a second waterproof layer. In the end, assembling the printed circuit board, sealed with the waterproof layers, into a case to form the waterproof electronic device.

Abstract translation: 提供了一种电子设备和防水电子设备的防水方法。 电子设备包括印刷电路板，其包括板，多个电气元件和按钮装置。 防水方法包括以下步骤：施加第一非固体粘合剂以直接覆盖按钮装置，固化第一非固体粘合剂以形成第一防水层，施加第二非固体粘合剂以至少覆盖电气元件 直接固化第二非固体粘合剂以形成第二防水层。 最后，将用防水层密封的印刷电路板组装成壳体以形成防水电子装置。