公开(公告)号：US20110300705A1

公开(公告)日：2011-12-08

申请号：US13209456

申请日：2011-08-15

Applicant: Jing-Hong Yang

Inventor： Jing-Hong Yang

IPC: H01L21/3213

CPC classification number: H05K3/4007 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/1148 ,  H01L2224/13007 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13565 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/243 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2203/054 ,  H05K2203/0597

Abstract: A manufacturing method of a bump structure with an annular support includes the following steps. A substrate including pads and a passivation layer is provided. The passivation has first openings exposing a portion of the pads. An UBM material layer is formed to cover the passivation layer and the pads. A patterned photoresist layer, having second openings respectively exposing the UBM material layer over the pads, is formed on the UBM material layer. A diameter of each second opening located on a lower surface of the patterned photoresist layer is less than that located on an upper surface of the patterned photoresist layer. Bumps are formed in the second openings. A portion of the patterned photoresist layer is removed to form an annular support at a periphery of each bump. The UBM material layer is patterned using the annular supports and the bumps as masks to form UBM layers.

Abstract translation: 具有环形支撑件的凸块结构的制造方法包括以下步骤。 提供了包括焊盘和钝化层的衬底。 钝化具有暴露一部分焊盘的第一开口。 形成UBM材料层以覆盖钝化层和焊盘。 在UBM材料层上形成具有分别将UBM材料层暴露在焊盘上的第二开口的图案化光致抗蚀剂层。 位于图案化光致抗蚀剂层的下表面上的每个第二开口的直径小于位于图案化光致抗蚀剂层的上表面上的每个第二开口的直径。 在第二开口中形成凸起。 去除图案化光致抗蚀剂层的一部分以在每个凸起的周边形成环形支撑。 UBM材料层使用环形支撑件和凸块作为掩模来图案化以形成UBM层。

公开(公告)号：US20080169559A1

公开(公告)日：2008-07-17

申请号：US11693741

申请日：2007-03-30

Applicant: Jing-Hong Yang

Inventor： Jing-Hong Yang

IPC: H01L23/48 ,  H01L21/3205

CPC classification number: H05K3/4007 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/1148 ,  H01L2224/13007 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13565 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/243 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2203/054 ,  H05K2203/0597

Abstract: A bump structure with an annular support suitable for being disposed on a substrate is provided. The substrate has at least one pad and a passivation layer that has at least one opening exposing a portion of the pad. The bump structure with the annular support includes an under ball metal (UBM) layer, a bump, and an annular support. The UBM layer is disposed on the passivation layer and covers the pad exposed by the passivation layer. The bump is disposed on the UBM layer over the pad, and a diameter of a lower surface of the bump is less than the diameter of an upper surface thereof. The annular support surrounds and contacts the bump, and a material of the annular support is photoresist. An under cut effect is not apt to happen on the bump structure.

Abstract translation: 提供了一种具有适于设置在基板上的环形支撑件的凸块结构。 衬底具有至少一个焊盘和钝化层，其具有暴露焊盘的一部分的至少一个开口。 具有环形支撑件的凸起结构包括底部球金属（UBM）层，凸块和环形支撑件。 UBM层设置在钝化层上并覆盖由钝化层暴露的焊盘。 凸块设置在衬垫上的UBM层上，并且凸块的下表面的直径小于其上表面的直径。 环形支撑件围绕并接触凸起，并且环形支撑件的材料是光致抗蚀剂。 凹凸结构上不易发生切割效应。

公开(公告)号：US08268717B2

公开(公告)日：2012-09-18

申请号：US13209456

申请日：2011-08-15

Applicant: Jing-Hong Yang

Inventor： Jing-Hong Yang

IPC: H01L21/44

CPC classification number: H05K3/4007 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/1148 ,  H01L2224/13007 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13565 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/243 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2203/054 ,  H05K2203/0597

Abstract: A manufacturing method of a bump structure with an annular support includes the following steps. A substrate including pads and a passivation layer is provided. The passivation has first openings exposing a portion of the pads. An UBM material layer is formed to cover the passivation layer and the pads. A patterned photoresist layer, having second openings respectively exposing the UBM material layer over the pads, is formed on the UBM material layer. A diameter of each second opening located on a lower surface of the patterned photoresist layer is less than that located on an upper surface of the patterned photoresist layer. Bumps are formed in the second openings. A portion of the patterned photoresist layer is removed to form an annular support at a periphery of each bump. The UBM material layer is patterned using the annular supports and the bumps as masks to form UBM layers.

Abstract translation: 具有环形支撑件的凸块结构的制造方法包括以下步骤。 提供了包括焊盘和钝化层的衬底。 钝化具有暴露一部分焊盘的第一开口。 形成UBM材料层以覆盖钝化层和焊盘。 在UBM材料层上形成具有分别将UBM材料层暴露在焊盘上的第二开口的图案化光致抗蚀剂层。 位于图案化光致抗蚀剂层的下表面上的每个第二开口的直径小于位于图案化光致抗蚀剂层的上表面上的每个第二开口的直径。 在第二开口中形成凸起。 去除图案化光致抗蚀剂层的一部分以在每个凸起的周边形成环形支撑。 UBM材料层使用环形支撑件和凸块作为掩模来图案化以形成UBM层。

公开(公告)号：US08030767B2

公开(公告)日：2011-10-04

申请号：US11693741

申请日：2007-03-30

Applicant: Jing-Hong Yang

Inventor： Jing-Hong Yang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K3/4007 ,  H01L24/03 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/1148 ,  H01L2224/13007 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13565 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/243 ,  H05K2201/0367 ,  H05K2201/09845 ,  H05K2203/054 ,  H05K2203/0597

Abstract: A bump structure with an annular support suitable for being disposed on a substrate is provided. The substrate has at least one pad and a passivation layer that has at least one opening exposing a portion of the pad. The bump structure with the annular support includes an under ball metal (UBM) layer, a bump, and an annular support. The UBM layer is disposed on the passivation layer and covers the pad exposed by the passivation layer. The bump is disposed on the UBM layer over the pad, and a diameter of a lower surface of the bump is less than the diameter of an upper surface thereof. The annular support surrounds and contacts the bump, and a material of the annular support is photoresist. An under cut effect is not apt to happen on the bump structure.

Abstract translation: 提供了一种具有适于设置在基板上的环形支撑件的凸块结构。 衬底具有至少一个焊盘和钝化层，其具有暴露焊盘的一部分的至少一个开口。 具有环形支撑件的凸起结构包括底部球金属（UBM）层，凸块和环形支撑件。 UBM层设置在钝化层上并覆盖由钝化层暴露的焊盘。 凸块设置在衬垫上的UBM层上，并且凸块的下表面的直径小于其上表面的直径。 环形支撑件围绕并接触凸起，并且环形支撑件的材料是光致抗蚀剂。 凹凸结构上不易发生切割效应。