公开(公告)号：US07324335B2

公开(公告)日：2008-01-29

申请号：US11175376

申请日：2005-07-07

Applicant: Junya Sueyoshi

Inventor： Junya Sueyoshi

IPC: G06F1/16 ,  H05K7/00

CPC classification number: G11B33/126 ,  G06F1/189 ,  H05K7/1457

Abstract: In a disk array system, techniques advantageous in terms of economy and maintenance and capable of realizing high-density wiring of data signal wiring and power feed wiring on a backboard, and flexibly implementing specification change, processing performance improvement, etc. are provided according to a DKC mounting method different from conventional ones. In a power feed unit of the backboard, the power feed wiring comprises a bus bar of three-dimensional structure which reserves a gap distance with respect to a face of the backboard. The data signal wiring connecting connectors is provided in an area below the bus bar, thereby providing high-density wiring. The gap distance is formed to meet a design specification which makes the power supply noise influence of the power feed wiring of the bus bar on the data signal wiring satisfactory small. Power feed connectors and locator pins for logical packages are connected on the bus bar.

Abstract translation: 在磁盘阵列系统中，根据经济和维护方面有利的技术，能够实现背板上的数据信号布线和馈电布线的高密度布线，灵活实现规格变更，处理性能改进等。 与常规DKC安装方式不同。 在背板的供电单元中，馈电布线包括三维结构的母线，其相对于背板的面保留间隙距离。 数据信号线连接连接器设置在汇流条下面的区域，从而提供高密度布线。 形成间隙距离以符合设计规范，使得母线的馈电布线对数据信号布线的电源噪声影响令人满意。 母线上连接有用于逻辑封装的供电连接器和定位销。

公开(公告)号：US20080207015A1

公开(公告)日：2008-08-28

申请号：US12003996

申请日：2008-01-04

Applicant: Junya Sueyoshi

Inventor： Junya Sueyoshi

IPC: H01R12/00

CPC classification number: H05K3/308 ,  H01R12/585 ,  H05K3/325 ,  H05K2201/092 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: Provided is a printed wiring board formed with a through-hole into which a press-fit pin is press-fitted. The printed wiring board includes at least one signal transmission layer, a signal transmission wiring pattern formed in the signal transmission layer, and an electrode portion of the signal transmission wiring pattern exposed at an inner circumferential surface of the through-hole. The electrode portion is not formed covering the entire inner circumferential surface of the through-hole but at a part of the inner circumferential surface of the through-hole.

Abstract translation: 提供了一种形成有压配合销的通孔的印刷线路板。 印刷布线板包括至少一个信号传输层，形成在信号传输层中的信号传输布线图案，以及在通孔的内周表面处暴露的信号传输布线图案的电极部分。 电极部不形成为覆盖通孔的整个内周面，而是形成在通孔的内周面的一部分。

公开(公告)号：US20060262657A1

公开(公告)日：2006-11-23

申请号：US11175376

申请日：2005-07-07

Applicant: Junya Sueyoshi

Inventor： Junya Sueyoshi

IPC: H04B1/20

CPC classification number: G11B33/126 ,  G06F1/189 ,  H05K7/1457

Abstract: In a disk array system, techniques advantageous in terms of economy and maintenance and capable of realizing high-density wiring of data signal wiring and power feed wiring on a backboard, and flexibly implementing specification change, processing performance improvement, etc. are provided according to a DKC mounting method different from conventional ones. In a power feed unit of the backboard, the power feed wiring comprises a bus bar of three-dimensional structure which reserves a gap distance with respect to a face of the backboard. The data signal wiring connecting connectors is provided in an area below the bus bar, thereby providing high-density wiring. The gap distance is formed to meet a design specification which makes the power supply noise influence of the power feed wiring of the bus bar on the data signal wiring satisfactory small. Power feed connectors and locator pins for logical packages are connected on the bus bar.

Abstract translation: 在磁盘阵列系统中，根据经济和维护方面有利的技术，能够实现背板上的数据信号布线和馈电布线的高密度布线，灵活实现规格变更，处理性能改进等。 与常规DKC安装方式不同。 在背板的供电单元中，馈电布线包括三维结构的母线，其相对于背板的面保留间隙距离。 数据信号线连接连接器设置在汇流条下面的区域，从而提供高密度布线。 形成间隙距离以符合设计规范，使得母线的馈电布线对数据信号布线的电源噪声影响令人满意。 母线上连接有用于逻辑封装的供电连接器和定位销。