公开(公告)号：US09847306B2

公开(公告)日：2017-12-19

申请号：US15448443

申请日：2017-03-02

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Fongru Lin ,  Yoshihiro Iida

IPC: H01L23/00 ,  H01L23/66 ,  H01L23/552 ,  H01L23/498 ,  H05K1/18 ,  H01L23/495

CPC classification number: H01L23/66 ,  H01L23/49531 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/552 ,  H01L24/16 ,  H01L2223/6638 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/49109 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0253 ,  H05K2201/09272 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10734

Abstract: A circuit board includes an insulating layer, a ground layer formed on a first surface of the insulating layer and including a plurality of openings arranged in first and second surface directions, each of the openings having a shape of a polygon having five or more sides, and a wiring layer formed on a second surface of the insulating layer opposite to the first surface.