公开(公告)号：US20170250507A1

公开(公告)日：2017-08-31

申请号：US15259209

申请日：2016-09-08

Applicant: Kabushiki Kaisha Toshiba

Inventor： Shiro HARASHIMA ,  Masayuki DOHI

IPC: H01R24/60 ,  H01R12/57 ,  H01R12/71

CPC classification number: H01R24/60 ,  H01R12/57 ,  H01R12/724 ,  H01R2107/00

Abstract: According to one embodiment, an electronic device includes a substrate, a male connector, and conductive members. The substrate includes conductors on a surface of the substrate. The male connector is mounted on the substrate and insertable into a female connector complying with a USB Type-C standard. The conductive members are mounted in the male connector, each of the conductive members electrically connecting one of twenty-four terminals complying with the USB Type-C standard mounted in the female connector with one of the conductors when the male connector is inserted into the female connector, and a number of the conductive members being less than twenty-four.

公开(公告)号：US20170271804A1

公开(公告)日：2017-09-21

申请号：US15450331

申请日：2017-03-06

Applicant: Kabushiki Kaisha Toshiba

Inventor： Kosuke ADACHI ,  Shiro HARASHIMA ,  Shanying PAN

IPC: H01R13/44 ,  H01R13/66

CPC classification number: G06K19/07732 ,  G06K19/00

Abstract: A slide structure comprises first and second members, a slider, a guide, and a first elastic part. The second member is movably supported by the first member. The slider is provided in one of the first member and the second member. The guide is provided in the other of the first member and the second member. The guide movably supports the slider among a first holding position, a slide section, and a second holding position. The first holding position is away or offset from a first position in a first direction. The slide section extends between the first position and a second position. The second position is distant from the first position in a second direction intersecting with the first direction. The second holding position is away or offset from the second position in the first direction.

公开(公告)号：US20150048490A1

公开(公告)日：2015-02-19

申请号：US14140725

申请日：2013-12-26

Applicant: Kabushiki Kaisha Toshiba

Inventor： Shiro HARASHIMA

IPC: H01L23/58 ,  H01L23/10

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L24/06 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/04042 ,  H01L2224/06135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06537 ,  H01L2924/00014 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: According to one embodiment, a memory module includes a substrate, a semiconductor memory device, a plate-form conductive member, wire, and a mold member. The substrate includes a ground terminal to which a ground potential is applied. The semiconductor memory device is provided on the substrate. The plate-form conductive member is provided on the semiconductor memory device. The wire that electrically connects the ground terminal to the plate-form conductive member. The mold member seals the semiconductor memory device on the substrate, the plate-form conductive member and the wire.

Abstract translation: 根据一个实施例，存储器模块包括衬底，半导体存储器件，板状导电构件，导线和模具构件。 衬底包括施加接地电位的接地端子。 半导体存储器件设置在衬底上。 板形导电部件设置在半导体存储器件上。 将接地端子电连接到板状导电部件的导线。 模具构件密封衬底上的半导体存储器件，板状导电构件和线。

公开(公告)号：US20170214169A1

公开(公告)日：2017-07-27

申请号：US15255695

申请日：2016-09-02

Applicant: Kabushiki Kaisha Toshiba

Inventor： Toshiyuki HAYAKAWA ,  Shiro HARASHIMA

IPC: H01R13/447 ,  H01R24/60 ,  G06F1/16

CPC classification number: H01R13/447 ,  G06F1/1656 ,  G06F1/181 ,  G06K19/07732 ,  H01R24/60 ,  H01R2107/00 ,  H05K5/0278

Abstract: According to an embodiment, an electronic device includes: a housing including a first face facing a first direction, a second face on an opposite side of the first face, and a third face adjacent to the first and second faces; a connector protruding from the third face; and a first cover connected to the housing, including a fourth face, and being pivotable between a first position where the fourth face faces the first direction and a second position where the fourth face faces the first face. The first cover includes a first stopper that, when the t cover pivots from the first position to the second position, contacts the connector and is elastically deformable in a direction that is a pivoting axial direction of the first cover and is a separating direction from the connector.

公开(公告)号：US20170071075A1

公开(公告)日：2017-03-09

申请号：US15062359

申请日：2016-03-07

Applicant: Kabushiki Kaisha Toshiba

Inventor： Toshiyuki HAYAKAWA ,  Shiro HARASHIMA

IPC: H05K7/20 ,  G06K19/077 ,  H05K5/02

CPC classification number: H05K7/2039 ,  G06K19/07732 ,  H05K5/0278 ,  H05K7/20445

Abstract: A semiconductor storage device includes a substrate having a wiring, a first semiconductor memory, a terminal portion, a holder surrounding the terminal portion, a case, and a first plate-shaped member. The first semiconductor memory is disposed on a first principal surface of the substrate and is connected to the wiring. The terminal portion is connected to the substrate at a first end portion of the substrate and has a terminal connected to the wiring. The case houses part of the holder, the substrate, and the first semiconductor memory. Between the first principal surface and a first wall portion of the case facing the first principal surface, the first plate-shaped member is disposed. The first plate-shaped member is connected to the holder and the first principal surface on a second end portion side of the substrate, and has thermal conductivity.

Abstract translation: 半导体存储装置包括具有布线的基板，第一半导体存储器，端子部分，围绕端子部分的保持器，壳体和第一板状构件。 第一半导体存储器设置在基板的第一主表面上并连接到布线。 端子部分在基板的第一端部处连接到基板，并且具有连接到布线的端子。 壳体容纳保持器，基板和第一半导体存储器的一部分。 在第一主表面和面向第一主表面的壳体的第一壁部之间设置第一板状构件。 第一板状构件连接到基板的支架和第二端部侧的第一主面，并具有导热性。

公开(公告)号：US20160073489A1

公开(公告)日：2016-03-10

申请号：US14637294

申请日：2015-03-03

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Shiro HARASHIMA ,  Masayuki DOHI ,  Masaki HIGA ,  Takeshi MITSUHASHI ,  Masaaki TAKAHASHI

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K1/118 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09445

Abstract: A module includes a base substrate, a flexible substrate including a first portion that is disposed on the substrate and a second portion that is bent from an end of the first portion toward the first portion, and a terminal exposed at the second portion of the flexible substrate. Another module includes a substrate, a convex portion disposed on the substrate, a terminal disposed on the substrate, and a first conductive member including a first portion which is disposed on the substrate and the terminal and is connected to the terminal, and a second portion extending from the first portion and along the surface of the convex portion.

Abstract translation: 模块包括基底基板，柔性基板，包括设置在基板上的第一部分和从第一部分朝向第一部分弯曲的第二部分，以及在柔性基板的第二部分处露出的端子 基质。 另一模块包括衬底，设置在衬底上的凸起部分，设置在衬底上的端子，以及第一导电构件，第一导电构件包括布置在衬底和端子上并连接到端子的第一部分，第二部分 从第一部分延伸并沿着凸部的表面延伸。