公开(公告)号：US11744010B2

公开(公告)日：2023-08-29

申请号：US17573588

申请日：2022-01-11

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Ya-Han Chang

IPC: H05K1/02 ,  G02B7/02 ,  G02B7/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0274 ,  G02B7/006 ,  G02B7/02 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the surface of the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, a light-permeable sheet, and a top shielding layer. The circuit board has no slot recessed in the surface thereof. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip. The top shielding layer is formed on an outer surface of the light-permeable sheet and has an opening that is located above a sensing region of the sensor chip.

公开(公告)号：US12108517B2

公开(公告)日：2024-10-01

申请号：US17580577

申请日：2022-01-20

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Li-Chun Hung ,  Ya-Han Chang

IPC: H05K1/02 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0274 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H05K1/11 ,  H05K1/181 ,  H01L2224/32225 ,  H01L2224/48228 ,  H01L2224/73215 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to the circuit board, a sensor chip and an extending wall both assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The extending wall surrounds the sensor chip and has an extending top surface that is substantially flush with a top surface of the sensor chip. The supporting adhesive layer is in a ringed shape and is disposed on the extending top surface of the extending wall and the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer, so that the light-permeable sheet, the supporting adhesive layer, and the top surface of the sensor chip jointly define an enclosed space.

公开(公告)号：US12174446B2

公开(公告)日：2024-12-24

申请号：US17688976

申请日：2022-03-08

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Li-Chun Hung ,  Chien-Yuan Wang

IPC: G02B7/02 ,  H04N23/54 ,  H04N23/55 ,  H05K1/18

Abstract: A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed on the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupled to the sensor chip and the circuit board, and a cover that overcovers the sensor chip and the wires. The cover includes a light-permeable sheet and an opaque frame. The light-permeable sheet has a ring-shaped notch recessed in an edge of an inner surface thereof. The opaque frame is formed on the ring-shaped notch and is disposed on the circuit board, the light-permeable sheet and the sensor chip are spaced apart from each other, and the sensor chip and the wires are arranged in a space that is defined by the light-permeable sheet and the opaque frame.

公开(公告)号：US11792497B2

公开(公告)日：2023-10-17

申请号：US17667625

申请日：2022-02-09

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Jui-Hung Hsu

IPC: H04N5/335 ,  H04N23/54 ,  H04N23/51 ,  H04N23/55

CPC classification number: H04N23/54 ,  H04N23/51 ,  H04N23/55

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The circuit board has a chip-receiving slot recessed in the surface thereof. The sensor chip is arranged in the chip-receiving slot, and a top surface of the sensor chip and the surface of the circuit board have a step difference therebetween that is less than or equal to 10 μm. The supporting adhesive layer is in a ringed shape and is disposed on the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

公开(公告)号：US11723147B2

公开(公告)日：2023-08-08

申请号：US17667486

申请日：2022-02-08

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Jui-Hung Hsu

IPC: G02B7/00 ,  H05K1/11 ,  G02B7/02 ,  H05K1/02

CPC classification number: H05K1/111 ,  G02B7/006 ,  G02B7/02 ,  H05K1/0274 ,  H05K2201/09409 ,  H05K2201/09445 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.