CMUT DEVICE MANUFACTURING METHOD, CMUT DEVICE AND APPARATUS
    1.
    发明申请
    CMUT DEVICE MANUFACTURING METHOD, CMUT DEVICE AND APPARATUS 审中-公开
    CMUT设备制造方法,CMUT设备和设备

    公开(公告)号:US20160228915A1

    公开(公告)日:2016-08-11

    申请号:US15021962

    申请日:2014-09-15

    Abstract: Disclosed is a method of manufacturing a capacitive micro-machined ultrasonic transducer (CMUT) device comprising a first electrode (112) on a substrate (110) and a second electrode (122) embedded in an electrically insulating membrane, the first electrode and the membrane being separated by a cavity (130) formed by the removal of a sacrificial material (116) in between the first electrode and the membrane, the method comprising forming a membrane portion (22) on the second electrode and a further membrane portion (24) extending from the membrane portion towards the substrate alongside the sacrificial material, wherein the respective thicknesses the membrane portion and the further membrane portion exceed the thickness of the sacrificial material prior to forming said cavity. A CMUT device manufactured in accordance with this method and an apparatus comprising such a CMUT device are also disclosed.

    Abstract translation: 公开了一种制造电容微加工超声波换能器(CMUT)装置的方法,该装置包括在基板上的第一电极和埋在电绝缘膜中的第二电极,第一电极和膜 由通过在第一电极和膜之间移除牺牲材料(116)而形成的空腔(130)隔开,所述方法包括在所述第二电极上形成膜部分(22)和另外的膜部分(24) 在牺牲材料旁边从膜部分朝向衬底延伸,其中在形成所述腔体之前,膜部分和另外的膜部分超过牺牲材料的厚度的相应厚度。 还公开了根据该方法制造的CMUT装置和包括这种CMUT装置的装置。

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