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    ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
    2.
    发明申请
    ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE 有权

    公开(公告)号：US20210272868A1

    公开(公告)日：2021-09-02

    申请号：US17254458

    申请日：2019-06-26

    Applicant: KYOCERA Corporation

    Inventor： Noboru KITAZUMI ,  Yousuke MORIYAMA

    IPC: H01L23/367 ,  H01L23/15 ,  H01L23/498

    Abstract: An electronic element mounting substrate includes: a first substrate including a first principal face and a second principal face opposite to the first principal face; a second substrate including a third principal face and a fourth principal face opposite to the third principal face, the second substrate being made of a carbon material; and a plurality of via conductors that are arranged in the first substrate. The second substrate is located inside the first substrate in the plan view. In the plan view, the plurality of via conductors are arranged with the second substrate in between. In the plan view, heat conduction of the second substrate is greater in a direction perpendicular to a direction in which the plurality of via conductors are arranged with the second substrate in between than in the direction in which the plurality of via conductors are arranged with the second substrate in between.

    IMAGING ELEMENT MOUNTING SUBSTRATE AND IMAGING DEVICE
    4.
    发明申请
    IMAGING ELEMENT MOUNTING SUBSTRATE AND IMAGING DEVICE 有权
    成像元件安装基板和成像装置

    公开(公告)号：US20160254302A1

    公开(公告)日：2016-09-01

    申请号：US15029916

    申请日：2014-10-20

    Applicant: KYOCERA CORPORATION

    Inventor： Shinji ICHIKI ,  Yousuke MORIYAMA

    IPC: H01L27/146 ,  H01L23/498

    CPC classification number: H01L27/14618 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16225

    Abstract: An imaging element mounting substrate includes: an insulating base comprising insulating layers, the insulating base surface comprising an opening which is located at a center thereof; a connection electrode disposed at a lower surface of the insulating base around the opening; and light-transmission control layers between the insulating layers, and comprising inner edges located on an outside of the opening. An inner edge of one light-transmission control layer lies closer to the opening than an inner edge of another light-transmission control layer as seen in a transparent plan view, and the insulating base has, in an inner periphery of the opening of an insulating layer constituting a lower surface of the insulating base, an inclined portion which is inclined such that the opening becomes smaller in size from the lower surface as approaching an upper surface of the insulating base.

    Abstract translation: 成像元件安装基板包括：绝缘基底，其包括绝缘层，所述绝缘基底表面包括位于其中心的开口; 连接电极，设置在所述绝缘基体的围绕所述开口的下表面; 以及位于绝缘层之间的光透射控制层，并且包括位于开口外侧的内边缘。 如透明平面图所示，一个光传输控制层的内边缘比另一光透射控制层的内边缘更靠近开口，并且绝缘基底在绝缘体的开口的内周 构成绝缘基底的下表面的倾斜部分倾斜，使得当接近绝缘基底的上表面时，开口的尺寸从下表面变小。

    SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
    6.
    发明申请
    SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE 有权

    公开(公告)号：US20210059047A1

    公开(公告)日：2021-02-25

    申请号：US16965855

    申请日：2019-01-30

    Applicant: KYOCERA Corporation

    Inventor： Yukio MORITA ,  Noboru KITAZUMI ,  Yousuke MORIYAMA

    IPC: H05K1/03 ,  H01L23/12

    Abstract: A first substrate includes a first surface and a second surface opposite to the first surface. A second substrate includes a third surface and a fourth surface opposite to the third surface. A third substrate includes a fifth surface and a sixth surface opposite to the fifth surface. The first substrate is made of an insulator, and includes a mounting portion for mounting an electronic element at the first surface, and the mounting portion for mounting the electronic element is a rectangular shape. The third substrate is made of a carbon material, and the fifth surface is connected to at least the second surface at location overlapped with the mounting portion for mounting the electronic element in plan view. The third substrate has a larger heat conduction in a direction perpendicular to the longitudinal direction of the mounting portion than heat conduction in the longitudinal direction of the mounting portion in plan view.

    WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
    7.
    发明申请
    WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE 审中-公开

    公开(公告)号：US20190273036A1

    公开(公告)日：2019-09-05

    申请号：US16418636

    申请日：2019-05-21

    Applicant: KYOCERA Corporation

    Inventor： Michio IMAYOSHI ,  Yousuke MORIYAMA

    IPC: H01L23/498 ,  H05K1/02 ,  H05K3/46 ,  H01L23/13 ,  H01L33/62 ,  H01L21/48 ,  H01L33/52

    Abstract: A wiring board includes an insulating substrate that is rectangular in a plan view, a plurality of mount electrodes arranged to face each other on a first main surface of the insulating substrate along a pair of opposing sides of the insulating substrate in a plan view, a plurality of terminal electrodes arranged to face each other on a second main surface of the insulating substrate along the pair of opposing sides of the insulating substrate in a perspective plan view, and an inner metal layer arranged inside the insulating substrate and extending in a direction perpendicular to the pair of opposing sides of the insulating substrate in a perspective plan view.

    ELECTRONIC ELEMENT MOUNTING BOARD AND ELECTRONIC DEVICE
    9.
    发明申请
    ELECTRONIC ELEMENT MOUNTING BOARD AND ELECTRONIC DEVICE 有权
    电子元件安装板和电子设备

    公开(公告)号：US20150319846A1

    公开(公告)日：2015-11-05

    申请号：US14650353

    申请日：2014-04-28

    Applicant: KYOCERA CORPORATION

    Inventor： Shuya KUBO ,  Kouki SUDA ,  Tsuyoshi ISHIMABUSHI ,  Shinji ICHIKI ,  Yousuke MORIYAMA

    IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

    CPC classification number: H05K1/0216 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49866 ,  H01L27/14618 ,  H01L2224/16225 ,  H05K1/111 ,  H05K1/181 ,  H05K1/183 ,  H05K2201/0116 ,  H05K2201/09036 ,  H05K2201/10121 ,  H05K2201/2018 ,  Y02P70/611

    Abstract: There are provided an electronic element mounting board and an electronic device capable of suppressing transmission of incident light to an electronic device through a circumferential edge part of an opening of a board and thus of reducing a noise level in receiving an image. An electronic element mounting board includes an insulating substrate. The insulating substrate has an opening and a lower surface, and an electronic element is disposed on the lower surface so as to overlap the opening in a plan view. A circumferential edge part of the opening of the insulating substrate has a porosity lower than a porosity of a portion outside the circumferential edge part. Since it is possible to suppress transmission of incident light to the electronic element through the circumferential edge part, it is possible to reduce a noise level in receiving an image in the electronic element.

    Abstract translation: 提供了一种电子元件安装板和能够通过板的开口的周边部分抑制入射到电子设备的光的电子设备，从而降低了接收图像的噪声水平。 电子元件安装板包括绝缘基板。 绝缘基板具有开口和下表面，并且电子元件设置在下表面上以在平面图中与开口重叠。 绝缘基板的开口的周缘部的孔隙率低于圆周缘部外侧的部分的孔隙率。 由于可以通过周边部分抑制入射到电子元件的入射光的透射，因此可以降低接收电子元件中的图像的噪声水平。

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