公开(公告)号：US06521843B1

公开(公告)日：2003-02-18

申请号：US09304631

申请日：1999-05-04

Applicant: Kenji Kohya

Inventor： Kenji Kohya

IPC: H05K103

CPC classification number: H05K1/0216 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/09336 ,  H05K2201/09627 ,  H05K2201/09845

Abstract: A multilayer printed circuit board enables needless electro-magnetic radiation to be suppressed. Interlayer insulation materials are arranged in layer-built constitution between respective layers of a mixed wiring layer of a first signal and/or a power supply wiring, a first ground layer, a second ground layer, and a mixed wiring layer of a second signal and/or a power supply wiring. A through-hole for connecting the ground layers with each other is provided adjacently to a through-hole for connecting the signal and/or the power supply between these layers. According to the constitution, a return circuit current route of the signal and the power supply to the ground layers is secured. As a result, a loop made by the current becomes small, thus needless radiation of electro-magnetic wave is capable of being suppressed.

Abstract translation: 多层印刷电路板能够抑制不必要的电磁辐射。 层间绝缘材料以第一信号和/或电源布线，第一接地层，第二接地层和第二信号的混合布线层的混合布线层的各层之间的层间构造布置，并且 /或电源接线。 用于连接接地层的通孔相邻设置用于连接这些层之间的信号和/或电源的通孔。 根据该结构，确保信号的回路电流路径和对地层的电力供应。 结果，由电流产生的环路变小，因此能够抑制电磁波的不必要的辐射。

公开(公告)号：US06249062B1

公开(公告)日：2001-06-19

申请号：US09296234

申请日：1999-04-22

Applicant: Mitsuo Suzuki ,  Kenji Kohya ,  Masaru Deguchi

Inventor： Mitsuo Suzuki ,  Kenji Kohya ,  Masaru Deguchi

IPC: H04B328

CPC classification number: H05K9/0064 ,  H05K9/0018

Abstract: To provide a method of pseudogrounding which is capable of protecting against EMI by pseudogrounding communication lines, etc. without necessity of expensive ferrite cores and increasing the number of steps and cost. A wiring which is connected to an LSI (43) on a package and is connected to an external wiring (47) via a connector (461), radio-frequency connected via a capacitance (451, 452) to ta housing (42) in which protection against EMI is achieved so that the radiated noise energy is not higher than EMI restricted value level. This enables said wiring to be pseudogrounded.

Abstract translation: 提供一种假周边的方法，其能够通过伪环绕通信线路等来防止EMI，而不需要昂贵的铁氧体磁芯并增加步骤和成本。 连接到封装上的LSI（43）并且经由连接器（461）连接到外部布线（47）的布线，经由电容（451,452）经由电容（451,452）连接到ta外壳（42）的连接器 实现了抗EMI的保护，使得辐射噪声能量不高于EMI限制值水平。 这使得所述布线被假包围。